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Flip-Chip Bumping Solutions
flip-chip bumping solutios
* Back-end & Assembly includes Back-Grind, Laser Mark, SAW, ILB, POT)
Product View
gold bumping
Gold Bumping
soler bumping
Solder Bumping
Cu Pillar bumping
Cu Pillar bumping
Customized Bumping
Customized Bumping
Process features available
gold Gold Bumping

· Wafer Size Available : 200mm, 300mm
· Bump Pitch : ≥ 20um
· UBM Structure : TiW, Ti, Au (Seed Metal, PVD)
· Bumping Material : Au
gold Solder Bumping

· Wafer Size Available : 200mm, 300mm
· Bump Pitch : ≥ 40um· Bump Diameter : ≥ 20um
· UBM Structure : TiW, Ti, Cu (Seed Metal, PVD) / Cu, Ni (Electro-plated)
· Bumping Material : Lead-free Solder (Sn/1.5~2.5Ag)

 

gold Cu Pillar Bumping

· Wafer Size Available : 200mm, 300mm
· Bump Pitch : ≥ 40um
· Bump Size (X, Y) : ≥ 15um
· UBM Structure : TiW, Ti, Cu (Seed Metal, PVD)
· Bumping Material : Pure Cu with Solder-Cap (Sn/1.5~2.5Ag)