• overview
  • module
  • packaging
  • plating bump
  •  
Fan-in & Fan-out WLP Solutions
flip-chip bumping solutios
* Back-end includes Back-Grind, Laser Mark, SAW, Tape&Reel
Product View

 
FIWLP FOWLP
Product View FIWLP FOWLP
Wafer Size 200mm & 300mm 300mm
Features FIWLP
FOWLP2
FOWLP1
FOWLP2