R&D Division

   
  Organization that brings the future through
Science & Technology

Organization that brings the future through Science & Technology

Providing market leading innovative product and technology solutions in the field of electronic devices and materials by maximizing customer valuation.

Electronic devices

Electronic materials

ㆍFan-Out Wafer Level Package (FO-WLP)
ㆍSystem in Package (SiP)
ㆍSiP Module Solution
ㆍNext Gen. Touch Screen Panel (TSP)

ㆍAMOLED Phosphors
ㆍOxide Semiconductor materials for Solution process
ㆍSuperhydrophobic materials
ㆍDielectric for Semiconductor / Display
ㆍFunctional Nano Glass