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System in Package (SiP) Solution | |||||||
Providing high performance and functionality through the SiP platform by combining multiple active and passive components. Innovative solution to reduce the device size through design, process, and performance solutions. | |||||||
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-Implementation of System in Package by embedding a multi chip, passive component and stacking process based on Fan-out Platform. | |||||||
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ㆍMultiple & Heterogeneous Die Integration ㆍSpecific Embedded Passive Devices ㆍExtremely Thin & Small form factor ㆍPreformed Via Interconnection ㆍMulti-layer RDL (Up to 4-metal layer) & Double-side RDL ㆍFunctional - EMI shield & Thermal solution | |||||||
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ㆍMobile, Automotive, Connectivity ㆍAP, AI, MCU, Sensor, Memory ㆍIoT Module
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