| |||||||
| System in Package (SiP) Solution | |||||||
| Providing high performance and functionality through the SiP platform by combining multiple active and passive components. Innovative solution to reduce the device size through design, process, and performance solutions. | |||||||
| |||||||
| -Implementation of System in Package by embedding a multi chip, passive component and stacking process based on Fan-out Platform. | |||||||
| |||||||
| |||||||
| ㆍMultiple & Heterogeneous Die Integration ㆍSpecific Embedded Passive Devices ㆍExtremely Thin & Small form factor ㆍPreformed Via Interconnection ㆍMulti-layer RDL (Up to 4-metal layer) & Double-side RDL ㆍFunctional - EMI shield & Thermal solution | |||||||
| |||||||
| ㆍMobile, Automotive, Connectivity ㆍAP, AI, MCU, Sensor, Memory ㆍIoT Module
| |||||||
Technology
