Solder Bumping
Product features available
- Wafer Size Available
200mm, 300mm
- Bump Pitch
≥ 40um
- Bump Diameter
≥ 20um
- UBM Structure
TiW, Ti, Cu (Seed Metal, PVD) / Cu, Ni (Electro-plated)
- Bumping Material
Lead-free Solder (Sn1.3~2.8Ag)
Product features available
200mm, 300mm
≥ 40um
≥ 20um
TiW, Ti, Cu (Seed Metal, PVD) / Cu, Ni (Electro-plated)
Lead-free Solder (Sn1.3~2.8Ag)