Cu Pillar Bumping

Product features available

Cu Pillar Bumping 이미지
  • Wafer Size Available

    200mm, 300mm

  • Bump Pitch

    ≥ 30um

  • Bump Size (X, Y)
    (Cu pillar size+Solder Cap)

    ≥ 15um

  • UBM Structure

    TiW, Ti, Au (Seed Metal, PVD)

  • Bumping Material

    Pure Cu with Solder-Cap (Sn1.3~2.8Ag)