Extremely thin profile up to
0.3mm thickness

No limited fan out routing ratio

2.3D RDL interposer & 2.1D RDL
substrate packaging solution for
high I/O application

Ultra high density extreme thin
profile FOSiP solution with proper
EMI shield

mmWave & Cm scale antenna
integrated packaging

3D analog and digital function
integration thru active IC
embedded technology

Thermally enhanced high
performance FOWLP(Including
FOSiP)

Thinner profile & Minimum Footprint

Cost competitive solution

High yield & Turnkey solution

Thinner substrate with higher I/O
counts

Large body with warpage
controllable RDL build-up interposer

Multiple active electronic
component with with different
functionality in a single unit

Multiple functions associated with
system or sub system

Package-level antenna integration

Small form factor & design
flexibility with PKG level antenna

Improved electrical performance
by direct connection

High I/O capability and small form
factor

Reduced cost by replacing carriers
with metal plate

High input/output current
capability by thick RDL