VALUE
VALUE	CSP / BGA	EDP (Embedded Die Package)	PoP (Package on Package)	AiP (Antenna in Package)	CLP (Chiplet Package)
Product View
Features	Single or Multi-chip integration Active & Passive devices	Top device mounted at package process Cu-post & double-side RDL	Top device mounted at board assembly Cu-post & Double-side RDL	RDL patterned antenna	RDL interposer + Si bridge
Application	Mobile, Wearable, Automotive, Industry, Health care... (AP, Memory, Sensor, Optical...)