Features |
Single or Multi-chip integration - Active & Passive |
Chip-first & Chip-last combined |
Package stackable
Cu-post & Double-side RDL
|
RDL patterned antenna
|
RDL interposer + Si bridge
|
Application |
Communication Consumer, Automotive, Industrial, (RFFE, Wireless connectivity, mmWave, Wearable, Sensor, Power, IoT) |