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TEST

글로벌 수준의 테스트 서비스 경쟁력으로 첨단 IT 기기용 고성능 시스템반도체에
특화된 테스트 솔루션을 제공합니다.

TEST Solutions

  • Pad Test
  • Bumping
  • Wafer Test
  • Assembly
  • Final Test
  • Final Product

Application & Portfolio

  • SYSTEM IC Image
    SYSTEM IC
    MCU SoC DSP, ISP AI Custom IC Audio
  • PMIC (Power Management IC) Image
    PMIC (Power Management IC)
    Mobile Phone LED Lighting Automotive Battery Charger SSD
  • RF Image
    RF
    Wireless Transceiver 5G RF
  • DDI (Display Driver IC) Image
    DDI (Display Driver IC)
    Monitor,
    Laptop PC     Mobile Phone,
    Tablet PC     LCD/OLED TV Automotive Display Panel
  • system ic Image
    CIS(CMOS Image Sensor)
    Mobile Phone Laptop PC, Tablet PC Black Box Security Automotive
  • system ic Image
    IoT & Sensor
    Controller Memory Touch Sensor Security MCU

Product View

Application Tester Main Specification
Model Maker
CIS T2000 ISS Advantest 1Gbps
4.8GICAP, IPE3
RF V93000 Advantest 533Mbps
(up to 1.6Gbps by license option)
WSMX, WSPS, WSRF, RFIM6/18
Power

Logic

Analog

Mixed

SOC 		i-Flex Teradyne 200Mhz
VHFAC, BBAC
T2000 IPS Advantest 250Mbps, 500Mbps
(up to 1.0Gbps by license option)
GPWGD(24bit), AMO(24bit), GPWGD+AMO(32bit)
ETS600 Teradyne 66Mhz/133Mbps
Ultra-Flex Teradyne 100Mbps
(up to 1.6Gbps by license option)
UltraPAC80, UltraWave24
DDI ST670
ST6730/A 		Yokogawa 200Mhz
VHFAC, BBAC
T6372(ND2)
T6373(ND3)		 Advantest 875Mbps(DIO)
875Mbps(DIO) / 2.5Gbps(HSIF)
T6391(ND4) Advantest 1.1Gbps(DIO) / 4.0Gbps(UHSIF)

좌우로 드래그 해보세요

TEST Total Solution Provider

  • Test Program Development

  • Wafer Probe Test

  • Probe card, PIB Development & Maintenance

  • Package Final Test

  • Intelligent IT system Infra support

  • Turn-key service(BUMP – TEST – PACKAGE)

  • System U/I Development