Fan Out-WLP/PLP
입출력(I/O) 단자를 칩 바깥으로 재배열하여
칩을 보다 작게, 고성능으로 구현할 수 있는 미세 패키징 솔루션입니다.
FOWLP/PLP Solutions
-
- Panelization
-
- RDL&Bumping
-
- Wafer & Panel Test
-
- Back Grinding & Sawing
-
- Final Test
-
- Final Product
FOWLP Vs. FOPLP
To provide multiple package solutions, high reliability and functionality in a smaller footprint for expanding the portfolios
nepes Fan-out offers the manufacturing diversification
FOWLP (300mmRd) and PLP (600mmSq) with test & Back-end turnkey service
Product View
| VALUE | PLP | FOWLP |
|---|---|---|
| Product View |  |
 |
| Panel Size | 600mm | 300mm |
| Features |
|
|
|
||
nepes laweh
Address충청북도 괴산군 청안면 네패스로 30
Tel043-240-8500(내선2번)
nepes hayyim
Address100 East Main Ave. Laguna Technopark Biñan, Laguna, Philippines 4024
Tel+63-2-7902-5600