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BUSINESS

GLOBAL TOP-TIER PARTNER, NEPES

Fan Out-WLP/PLP

입출력(I/O) 단자를 칩 바깥으로 재배열하여
칩을 보다 작게, 고성능으로 구현할 수 있는 미세 패키징 솔루션입니다.

FOWLP/PLP Solutions

  • Panelization
  • RDL&Bumping
  • Wafer & Panel Test
  • Back Grinding & Sawing
  • Final Test
  • Final Product

FOWLP Vs. FOPLP

To provide multiple package solutions, high reliability and functionality in a smaller footprint for expanding the portfolios

nepes Fan-out offers the manufacturing diversification
FOWLP (300mmRd) and PLP (600mmSq) with test & Back-end turnkey service

Product View

VALUE FOWLP PLP
Product View
Panel Size 300mm 600mm
Features

  • High Reliability
    Meets JEDEC MSL3 CLR and BLR requirements

  • Low Profile Small Form

  • Integration & Size with SiP

  • Innovative process

  • Cost-effectiveness

[M-Series™]

[FOWLP : Face-up]

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