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Nepes' "Wafer Level Package" Selected as a 2023 World-Class Product

Advanced semiconductor packaging foundry specialist Nepes announced on the 9th at the 'World-Class Product Certification award Ceremony’ held at the Grand InterContinental Seoul Parnas, that their advanced packaging technology, Wafer Level Package (WLP), has been selected as a 'Current World-Class Product.'▲Nepes' WLP certified as '2023 Current World-Class Product' by the Ministry of Trade, Industry and Energy (Photo = Nepes) World-Class Products are distinguished annually by the Ministry of Trade, Industry and Energy and operated by the Korea Trade-Investment Promotion Agency (KOTRA), divided into 'Current World Class Products' and 'Next Generation World Class Products' to lead the global market, enhance corporate competitiveness, and contribute to export vitality. Nepes' Wafer Level Package was uniquely selected in the semiconductor sector as a 'Next Generation World Class Product' in 2016. Since then, it has renewed its certification, meeting conditions such as ranking within the top five in global market share and 5% or higher, along with an annual export scale of at least five million dollars, thereby newly elevating to the status of a 'Current World Class Product.' Wafer Level Packaging is an advanced packaging technology that performs bumping and Redistribution Layer (RDL) on fully processed wafers, differing from conventional packaging. Nepes successfully mass-produced advanced packaging applying bumping technology for the first time in Korea in 2000. Semiconductors utilizing this technology have significantly improved electrical characteristics due to shorter external connection wiring and also boast excellent heat dissipation properties, preventing overheating and effectively reducing production costs. Moreover, by forming solder bumps on the chip's I/O pads, replacing wires, it enables miniaturization and high integration, and is currently widely applied in mobile, PC, cameras, and more. Nepes has grown to become a core value chain in the domestic system semiconductor ecosystem based on commercializing advanced technologies such as Fan-out WLP and Fan-out Panel Level Package (FO-PLP), in a domestic market scarce of system semiconductor players. Currently, with global-level technology and manufacturing competitiveness, Nepes is attracting prominent overseas customers to Korea, expanding and sophisticating advanced foundry infrastructure. At the event, Lee Sang-min, manager of Nepes' management planning team, who received the certification, expressed, "It is very meaningful that Nepes' advanced packaging technology has been recognized for its excellence and marketability in the semiconductor industry and elevated to a 'Current World Class Product.' We will continue to strive to drive the ecosystem of system semiconductors in Korea and sustain our growth."  Additionally, Nepes presented a successful case study in the medium-sized enterprise category at the ceremony.

2023-11-09

Nepes Captivates Attendees at '2023 TECH INSIDE SHOW' with Its nePAC Technology

The nePAC development team of Nepes participated in the [2023 TECH INSIDE SHOW], which took place from the 18th to the 20th at KINTEX. ▲An exhibit detailing the concept of nePAC (Photo = nePAC Product Technology Division) At the event, Nepes showcased their cutting-edge packaging platform, nePAC (nepes Package in Advanced CX solution), based on RDL interposer and Fan-Out technology. As their primary exhibition theme, the platform, which specializes in 2.5D & 3D packaging, garnered both intrigue and enthusiastic responses from industry professionals. ▲ A visitor at the Nepes booth listening to an explanation about nePAC. (Photo = nePAC Product Technology Division) Kim Hyo-Young, the team Leader in charge of the nePAC development team, who oversaw the participation in the exhibition, stated, "Visitors primarily asked many questions regarding the performance of nePAC technology and materials." He added, "This exhibition is the first for nePAC, and it provided a meaningful opportunity to broadly promote the technical expertise of Nepes."[The [2023 TECH INSIDE SHOW] is an event where South Korean companies, government entities, and organizations in the materials, components, equipment, and foundational industries participate. It serves to showcase the excellence of these industries in South Korea, promoting company products and technologies, and linking them to potential business opportunities.

2023-10-27

Nepes to Deliver a Lecture on "FO-RDL-Based 5G mmWave AiP Technology" at ISMP 2023

Nepes, represented by CEO Byung-Koo Lee,  is set to participate in the International Symposium on Microelectronics and Packaging (ISMP) organized by the Korean Society for Microelectronics and Packaging (KMEPS) and deliver a lecture session. ISMP, now in its 21st edition, serves as a platform to explore the semiconductor packaging industry, share the latest technologies, and discuss strategies among various companies. Nepes, as the only domestic advanced packaging specialist, is returning to ISMP for the second time following its participation last year. In the "Package Design and Modeling2" session, Dr. Kang In-soo, the head of the semiconductor research institute, will present on the topic of "5G mmWave Antenna in Package based on Fan-out RDL Interposer Technology." The presentation will introduce Nepes' FO-AiP, highlighting its capabilities in reducing thickness and enhancing performance in antenna modules. The keynote speeches for the event will be delivered by Samsung Electronics and JCET. Additionally, attendees from 12 countries, including Korea, will explore the emerging trends in next-generation packaging technologies for industries such as artificial intelligence (AI), IoT, big data, and machine learning.  ISMP 2023 will take place at the Paradise Hotel Busan from the 25th to the 27th of this month.[ISMP 2023 Home Page] ; https://www.ismp.or.kr/html/

2023-10-23

Nepes to Participate in 'SEDEX 2023,' Introducing Advanced Packaging Technology

Nepes, represented by CEO Byung-Koo Lee, will showcase its advanced packaging technology at the 25th Semiconductor Exhibition (SEDEX).   SEDEX, celebrating its 25th anniversary this year, is the only specialized semiconductor exhibition in South Korea that encompasses all aspects of the semiconductor industry, including materials, components, and equipment.   Nepes, along with industry leaders like SK Hynix and KEY FOUNDRY, will represent the semiconductor sector in Chungcheongbuk-do at the Chungbuk Joint Pavilion. At SEDEX 2023, Nepes plans to exhibit its core capabilities in advanced packaging technology, featuring 'nePACTM (Nepes Package in Advanced CX Solution)' and physical displays of 600mm FOPLP (Fan-Out Panel Level Packaging), as well as 300mm/200mm WLP (Wafer Level Packaging). They aim to introduce their advanced packaging technology, capable of reducing the thickness and enhancing the performance of semiconductors.   SEDEX 2023 will feature the participation of around 250 domestic and international companies, including industry giants like Samsung Electronics and SK Hynix, occupying 800 booths. The event is scheduled to take place from the 25th to the 27th of this month at COEX in Samseong-dong, Seoul.[SEDEX 2023 Home page] ; https://sedex.org/public_html_eng/index.asp

2023-10-23

Nepes commercializes advanced FO-PLP technology replacing PI material, featured in Japanese Electron

The "Electronics Device Industry News" of Japan published a visit report on Nepes on October 19, 2023. The highlight of the report, which featured an interview with Nepes CEO, Byung-Koo Lee, was the industry's first commercialized MDxTM(Molded Direct) technology in collaboration with Deca Technologies.  This tech bypasses the use of Polyimide(PI), an essential material for the FO(Fan-out) technique, and only employs the Molding method to achieve FO-PLP. This simplification of the process is anticipated to serve as an alternative to the QFN(Quad Flat No-lead) process. Nepes plans to undergo testing until the end of 2023 and kick off mass production in 2024. They are especially looking to broaden the application of this technology in semiconductors for automobiles and expand their business into the Japanese market.   In 2021, Nepes was recognized as one of the global TOP 10 advanced packaging companies in a semiconductor supply chain report released by the White House in the USA. They play a pivotal role in the advanced packaging sector. CEO Lee Byung-goo stated, "By building partnerships with major global semiconductor companies and continuously developing technologies that cannot be addressed with our current processes, our goal is to become a top-tier advanced packaging company globally within the next five years."

2023-10-19

Nepes joins as a key partner for Samsung Electronics' Advanced Packaging (AVP) at the '2023 Advanced

Nepes, led by CEO Byung-Koo Lee, participated in the inaugural '2023 Advanced Semiconductor Packaging Show’ upon invitation from Samsung Electronics' AVP (Advanced PKG) business team.  ▲ Kang In-soo, Executive Director, explaining Nepes' advanced packaging technology to the visitors. (Photo= Nepes)   With the advanced semiconductor process facing significant costs and technical challenges, packaging technology to enhance chip performance is gaining attention. Last year, Samsung established an AVP (AdVanced Packaging) team to nurture advanced packaging and strengthen collaboration with technically capable partners. Having provided advanced packaging services since 2000, Nepes, as a core partner of Samsung, was invited to this exhibition, where they introduced their expertise through high-quality WLP processes, FOPLP, and the ultra-compact SiP, nePAC, captivating attendees' attention.   Co-hosted by Suwon City and Gyeonggi Province, the '2023 Next-Generation Semiconductor Packaging Equipment and Materials Industry Exhibition', the first post-process specialized semiconductor exhibition in Korea, opened on the 30th and will run for three days at the Gyeonggi Suwon Convention Center, ending today(9/1).

2023-09-01

Nepes Laweh, World's First Commercialization of PI Alternative Packaging Technology

Leading advanced packaging company Nepes Laweh continues its innovation in advanced package technology, following the 600mm FOPLP (Fan-out Panel Level Package). Nepes Laweh announced that they have, for the first time in the world, implemented FOPLP solely through the Molding technique, without using the expensive Polyimide (PI), which is an essential material in the fan-out process.▲Implementation of FO-PLP using PI alternative packaging technology(Photo=Nepes) Based on Deca Technologies' M-Series™, this technology has been commercialized for the first time in the world by Nepes Laweh, and they have recently initiated product supplies to analog and automotive semiconductor company in the United States. This technology, which does not use PI, not only simplifies the process and improves productivity, but also has the potential to enhance product reliability. It is expected that this technology can extensively replace traditional conventional molding packages, such as QFN. In particular, analog semiconductor manufacturers, who frequently need to change and develop various products, can reduce the supply risk of materials like PCBs and lead frames. Additionally, it is a strong advantage that this technology allows for the transition to the fan-out process while maintaining existing semiconductor specifications, thus reducing the burden of new certifications for customers. Especially for products with large production volumes and stringent front-end customer certifications, such as automotive Microcontroller Units (MCU), the company expects this technology to offer advantages in manufacturing and quality control. A Nepes official conveyed, “The commercialization of fan-out molding technology is expected to further strengthen our technological competitiveness in the advanced package market.” Nepes Laweh has strategized to expand its customer base by applying fan-out PLP technology to various application products, including industrial and automotive products, starting with the supply of analog semiconductor samples.

2023-08-18

Nepes participated in the '2023 ECTC(Electronic Components and Technology Conference)'

Nepes participated in the 2023 ECTC (Electronic Components and Technology Conference) held in Orlando, Florida, USA from May 30th to June 2nd and introduced its advanced semiconductor packaging technology. Celebrating its 73rd anniversary this year, ECTC is an international event hosted by the Electronics Packaging Society under the IEEE, and is a place where experts in the field of electronic parts, materials, packaging, and IoT attend to discuss next-generation semiconductor technologies. At this event, Nepes introduced next-generation PoP (Package on Package), 2.5D, and 3D stacking technologies as well as the world's first 600mm FOPLP solution that was successfully mass-produced. FOPLP is a next-generation packaging solution that implements a fan-out package on a large square panel with a size of 600mm × 600mm, a step forward from the existing 300mm circular fan-out wafer level packaging (FOWLP). On the 31st, a paper titled “6-Sided Die Protection for Chiplet Package with Multi-Layer RDL” was selected and presented.

2023-06-02

Nepes joins 'UCIe' consortium to establish semiconductor packaging standards

Nepes participate in the UCIe(Universal Chiplet Interconnect Express) consortium launched to establish an industry standard for ‘Next-generation chip packaging technology’.Semiconductor companies such as ▲AMD ▲Arm ▲Qualcomm ▲ASE, including TSMC and Intel, and IT companies such as ▲Google Cloud ▲Meta ▲Microsoft also participated in the consortium.The consortium aims to establish UCIe as a new connectivity standard such as PCIe, USB, NVMe, etc.Members will soon begin working on the creation of the next-generation UCIe technology standard, including the chiplet form factor, management, enhanced security and other essential protocol definitions after the UCIe 1.0 specification is drafted.If the UCIe standard is established, it is compatible with other companies' chiplet structures. This can lead to cost savings and faster time to market.

2022-08-19

Nepes integrates packaging with advanced fan-out technology

“Heterogeneous integration,” a hot keyword in the global semiconductor marketNepes’s fan-out technology-applied “nSiP” & “nPoP” are the alternativesThe global semiconductor industry started to focus on the back-end process. As Moore’s law, which states that the semiconductor density doubles every two years, is no longer valid, and miniaturization of circuits in the front-end process is reaching its limit, the industry players are looking for alternatives. Among the alternatives, the “Heterogeneous Integration Packaging,” also referred to as a 2D and 3D packaging has been gaining attentions as the next-generation technology. It attaches chips in series and integrates them to a single semiconductor piece. On July 7th,Nepes introduced its unique technology “nSiP’ and “nPoP” along with the trends of the next-generation heterogeneous integration packaging at “Semiconductor Packaging Day 2022” held by Electronics Times, a Korean IT news media.Nepes is an advanced semiconductor packaging company that supplies the Wafer Level Packaging(WLP), Fan-Out Panel Level Packaging(FOPLP) and more.It is a pioneer in the back-end process as it commercialized the FOPLP technology for 600x600mm square panels, not round panels, for the first time in the world in May 2017.System in Package(SiP) introduced by Nepes at the conference, is a heterogeneous integration packaging technology with various functions put into a single chip. Nepes’s unique technology “nSiP” does not contain components such as substrates, reducing the packaging size to one third and shortening the signal transmission distance by 30% for performance improvement. Nepes produced its first commercialized nSiP in January. Package on Package(PoP) is a technology that adds a layer of package with a different function on top of another package. This technology minimizes heat generation from the chips and lowers the packaging thickness by 26% compared to competitors’ products. Mass production is scheduled to be in 4Q, 2023.Nepes’s unique packaging technologies are based on the Fan-Out technology that utilizes the Re-Distribution Layer(RDL). In the Fan-Out technology, the input/output terminals are located outside the chips to fit in a higher number of terminals. It is expected to be the solution for the ultra-high-performance and high-integration packaging market since it can be used to layer or expand different sizes of chips as well as to improve the electrical properties and thermal efficiency, In the meantime, the global packaging market size is expected to be driven by the SiP, Fan-Out, and PoP technologies and reach a $9.6 billion scale by 2026 according Yole, a market analysis firm. The PoP’s market share is expected to increase particularly high from 5% to 11%. Read more: https://www.digitaljournal.com/pr/nepes-integrates-packaging-with-advanced-fan-out-technology#ixzz7aC8RY0hV

2022-07-27

Nepes Rua Orchestra Hosts "33rd Anniversary of Nepes Founding / 1st Anniversary of Rua Orchestr

The Nepes Rua Orchestra held the "33rd Anniversary of Nepes Founding / 1st Anniversary of Rua Orchestra Inception Thanksgiving Concert" at Cheongju Art Center on the 20th.This performance, commemorating the 33rd anniversary of Nepes' establishment and the 1st anniversary of the Rua Orchestra's inception, was attended by about 420 individuals, including Nepes employees/families, faculty members of special education schools in the Cheongju area, and relevant members of disabled groups in the Chungbuk region. Together, they witnessed a moving performance.Under the passionate baton of conductor Nam-Jin Kim, the first act, themed 'Vocation' covered repertoire such as Mozart's 'Papageno Suite,' Brevval's 'Concerto no.1 F major 1st movement,' and Herbert's 'Italian Street Song.' The subsequent acts were themed 'Passion' for the second act, 'Faith' for the third, and 'Dream' for the fourth. The performances by Rua Orchestra members and Nepes music class instructors colored the hall with emotion and hope.Nepes Chairman Byung-Koo Lee, in his message of gratitude, conveyed, "I'm truly delighted and grateful to have this thanksgiving concert on the occasion of the 1st anniversary of the Rua Orchestra's inception." He further added, "I'd like to express my gratitude to Artistic Director Nam-Jin Kim, the guiding teachers, government officials, and all the sponsors who have generously supported us, allowing us to grow to a national scale within just a year."   

2023-10-23

Nepes Achieves a 31% Reduction in Winter 2022 LNG Demand, Receives '45 Million KRW' Incentive

Nepes has received a 45 million KRW incentive from the Korea Energy Agency after participating in the 'Urban Gas Demand Reduction Program' managed by the Korea Energy Agency and Korea Gas Corporation. The EHS & Infrastructure team, the department in charge, conducted energy-saving activities such as ▲Compressor waste heat recovery ▲Downward operating temperature of the air conditioner ▲Steam leak improvements and flexible operation of Once-Through Boiler. As a result, the ns2 campus reduced its gas consumption by 31% compared to the same period last year, achieving this significant milestone. The initiative, a joint campaign by the Korea Energy Agency and Korea Gas Corporation, ran from October of last year to March this year. It was established to ensure a stable natural gas supply due to the prolonged 'Russian invasion of Ukraine' conflict and to induce demand reduction in high energy-consuming areas.  Team leader Gil Hoseop of Nepes' EHS & Infrastructure team stated, "It's the fruition of the energy-saving efforts of every member of the n-family." He further added, "We will continue to lead in practicing ESG management through company-wide energy savings."

2023-09-08

Nepes Rua Orchestra to Perform Opening Act at the ‘Korea Elementary School Principal’s Association’

Nepes Rua Orchestra to Perform Opening Act at the ‘Korea Elementary School Principal’s Association’ Summer Training Conference on the 17th.▲Rua Orchestra performing on stage(Photo=Nepes Culture Division) The 'Rua Orchestra' under Nepes, conducted by Kim Namjin, performed the opening act at the 62nd Summer Training Conference of the Korea Elementary School Principal’s Association, which was held on August 17th at the Cheongju University Seokwoo Culturegym.▲Attendees enjoying the performance of the Rua Orchestra(Photo=Nepes Culture Division) In this event, attended by Deputy Prime Minister and Minister of Education Lee Ju-ho, along with over 4,000 elementary school principals from all over the country, the Rua Orchestra showcased a diverse repertoire that transcended classical and contemporary music, including 'B Rossette' from the drama OST and Johann Strauss’ Kaiserwalzer(Op. 437), eliciting a warm response from the attendees. 'Rua', which means 'to shout for joy', is Nepes' in-house orchestra that was established in May 2022. It is composed of 22 individuals with severe developmental disabilities and 12 leaders. With the goal of transforming their peers and the local community through music, and further contributing to social integration to create a healthy community, the Rua Orchestra is actively engaging in performances and leading the communication between disabled and non-disabled people in the field of cultural arts.

2023-08-18

Nepes, released the first ESG report...containing 'sustainable future'

Nepes, released the first ESG report...containing 'sustainable future' -Nepes expands the key principal of 'gratitude Management' to ESG activities -New creation of new jobs, expanding eco-friendly business, and achieving a 100% recycling rate. Nepes (the chairman Lee Byung-Koo ) has released an ESG report containing its sustainable business operation, ESG achievement and vision. The ESG report entitled 'Sustainable Future' includes Nepes ESG business operation vision and strategy, and its ESG achievement in 2021. Nepes has written environmental and safe business strategy and promotion of work, eco-friendly business and reduced environmentally influential activity in 2021, and released greenhouse gases, waste, and emission of air and water pollutants from its sites. For the business part of human resources , it also introduced creation of jobs and human resources development, which are the purposes of the company. Nepes have formed ESG TF since the declaration of ESG Life Management in 2021, conducted its own status inspection and evaluation by analyzing the reference indicators such as K-ESG and GRI, and is conducting ESG management activities linked to better performance outside based on their investments. From 2022, the ESG education curriculum has been added as an essential competency course for the S1 positions to create and familiarize its in-house ESG related vibe. Nepes plans to continually check and improve its ESG status to find more realistic and improved ESG implementation measures. Chairman Lee Byung-Koo said that "Since establishment of the Nepes, we have been following the management principle centered on the purpose of 'seeking the interests of others.'" He also added that "nepes have a great responsibility and our goal is be necessary to the world and we will patiently practice ESG management by sharing what we have with the world." The electronic document file of the Nepes ESG report can be found on their website (https://www.nepes.co.kr/kr/company/introduce.php). Nepes ESG report

2022-06-30

Nepes, visited an amusement park with members of the disabled orchestra

On May 31, Nepes visited an amusement park with members of the Nepes Disabled Orchestra 'Lua Chamber'.This 'Happy Together Outing' was designed to give warm memories to the members of the Rua Chamber, and they had a pleasant day wearing orange tees and riding rides.The Lua Chamber Orchestra consists of eight people who are disabled people employed by Nepes. They will hold an opening ceremony at the end of June and will carry out activities to spread the Nepes corporate culture based on music management both inside and outside.

2022-06-08

Nepes was introduced <The Fruit of Love> In the March issue.

▲Kim Nam-Chul, president of the semi BU, who participated in the cover model of <Fruit of Love>, Nepes staff Yoon Han-Gyeol, Im Ye-Won.Nepes was introduced in the March issue of The Fruit of Love, a monthly edition of the Love Fruit Social Welfare Community Chamber.The fruit of love is a public institution established in 1999, and it plays the role of supporting neighbors and small and medium social welfare organizations that need help through regular fundraising.It publishes the monthly sharing magazine "The Fruit of Love", and contains sharing issues in each region such as its own events, donors, and donation companies.In this March issue, Nepes was introduced as a representative company with a beautiful corporate culture in the Chungcheongbuk-do area.Nepes has been carrying out various social contribution activities linked to local communities and organizations under the philosophy of sharing management by Chairman Lee Byung-Koo.In particular, we donate some of the donations of 'n Sharing Seed', which is operated by 'Matching Grant Fund', to the fruits of love every month.'School Project', 'Children's Family Counseling Room', 'Covid 19 Support', 'Kimchi Dipping of Love', 'One-person Household Care Service'In the meantime, Nepes has introduced various sharing activities in <The Fruit of Love>.E-book t: https://nanumnews.or.kr/ebook/2203/

2022-04-20

Nepes signed an agreement to promote disabled employment with the KEAD

Nepes signed an agreement with the Korea Employment Agency for Persons with Disabilities(KEAD) for the Disabled to promote employment of the disabled on the 28th in the creative room of the ns2 campus. The signing ceremony was attended by Park Hyung-gun, president of management support, and Cha Jeong-hoon, director of employment promotion of the KEAD, and agreed to cooperate to create and support high-quality jobs for the disabled. According to the signing of this agreement, Nepes plans to establish and gradually expand an orchestra composed of members with disabilities to support job creation in the field of culture. 

2022-03-29

Nepes launches ESG campaign with 'Good Cycling'

Nepes has been campaigning for 'Good Cycling' for two weeks from March 7 to 18.The Good Cycling Campaign was prepared to encourage Nepes staff to participate voluntarily by emphasizing the effect of job creation and recycling of disabled people through product donations.This is not used by 40 staff, but it has donated 916 items including clothing, miscellaneous items, and household appliances that can be reused. The donated items were delivered to the MIRAL Welfare Foundation Good Will Store.The Good Will Store is a place that sells and reuses items donated by individuals and companies and supports resource cycles, and 273 disabled people are working in 13 stores.The goods Nepes donated through this campaign will be sold at the Daejeon and Gangnam stores, and the proceeds from sales will be used for salary support purposes for disabled employees. Nepes has been doing Goodwill Store goods donation activities since the last 2019 and continues to cooperate with the disabled for expanding employment and resource circulation.

2022-03-20

Nepes and Nepes Ark donated 60 million won in relief donations for Ukraine and wildfire damage

On the 14th, Nepes and Nepes Ark donated 60 million won to support international emergency relief activities caused by the Ukrainian war and support the Gangwon-do and Gyeongsangbuk-do wildfire damage.Nepes donated 30 million won to the Korean Red Cross to support Ukraine's emergency relief activities, and Nepes ark donated a total of 30 million won to the Korea Disaster Relief Association, including 5 million won of n-sharing seed, to support the forest fire damage area. In addition to this donation, Nepes has participated in sharing activities to support domestic and overseas disaster damage such as support for the volcanic eruption in the Philippines and prevention of the spread of COVID-19 in 2020 through "n sharing seeds" which is operated in a matching grant method.

2022-03-16

Nepes joins the The Red Cross Creating Shared Value(RCSV)

Nepes announced that it had participated in the 'The Red Cross Creating Shared Value(RCSV)' induction ceremony at 14:00 on the 28th (Tuesday) at the lobby of the Chungbuk branch of the Korean Red Cross.The Red Cross Creating Shared Value (RCSV), a corporate organization operated by the Korean Red Cross, is a socially shared value platform that systematizes Red Cross humanitarian and corporate social contribution activities.On this day, Nepes President Kim Nam-cheol, Sunwoo Chemtech CEO Cha Tae-hwan, and Korea Ceramics Co., Ltd. Managing Director Kim Nam-cheol attended the signing ceremony and took a commemorative photo, and delivered the sign-up plaque and name plate. Inducted into the Chungbuk Governor Hall of Fame.Nepes, a global semiconductor component manufacturer, has 'a life of service, a challenging attitude, and a grateful heart' as its key management philosophy, and continues to make efforts for the underprivileged in welfare blind spots such as voluntarily participating in sharing and contribution activities.

2021-12-28