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Nepes joins the American Semiconductor Innovation Coalition (ASIC)

Nepes joins the American Semiconductor Innovation Coalition (ASIC) to Strengthen Global Semiconductor CooperationNepes, led by Chairman Lee Byung-Koo,  has announced its participation in the American Semiconductor Innovation Coalition (ASIC) to help strengthen global semiconductor cooperation. As members of ASIC, Nepes will contribute to developing a strong proposal for a technical agenda in advanced packaging. ASIC is a coalition of more than 75 businesses, startups, universities, national labs, and nonprofits dedicated to bringing the best research and development to the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP). It aims to strengthen the diverse and competitive semiconductor workforce, make bold investments in semiconductor R&D, and academic infrastructure needed to deliver semiconductor innovation, prototyping and manufacturing in the United States. Dr. Douglas Grose, who is leading ASIC, said, “ASIC is focused on working collaboratively to develop new strategies and solutions for the U.S. semiconductor industry, and that includes partnerships with international organizations. We’re very pleased to have Nepes join ASIC and provide their expertise on advanced packaging, which is increasingly critical to the semiconductor industry both in the U.S. and worldwide.”  ASIC member companies include key companies in the semiconductor field in Korea, the US, Europe, and Japan. As OSAT companies, i3 Microsystems of the US and Nepes of Korea are participating.“As the importance and role of advanced packaging technology continues to grow, ASIC enables Nepes to further strengthen cooperation with leading global member companies,” said Kim Tae-hoon, president at Nepes. “It has given us an opportunity to raise the status of Korean companies’ advanced packaging technology and contribute to the development of the advanced back-end industry and the global semiconductor ecosystem.”

2022-06-21

Nepes promotes new packaging technology at an international conference

Nepes promotes new packaging technology at an international conferenceThe packaging provider introduces ‘nPLP’, a next-generation packaging solution The company also presents FOWLP-based antenna-in-package technology on the 3rd of this month Nepes presented at the 2022 Electronic Components and Technology Conference (ECTC), which took place in San Diego from May 31 to June 3 (PDT), to showcase its cutting-edge semiconductor packaging technology.Organized by IEEE Electronics Packaging Society, the conference is an international event attended by experts in the fields of electronic components and materials, packaging, and IoT to share their visions about future technology and discuss methods of cooperation. This year marks the 72nd iteration of ECTC. The 2022 ECTC brings together 106 corporations from 24 countries, including Nepes, Samsung Electronics, TSMC, and Amkor Technology. This year, Nepes became the world’s first company to successfully mass-produce its nPLP solution. An improvement over the previous 300-mm circular-> round FOWLP, nPLP is a next-generation packaging solution in which a fan-out package is implemented onto a 600-by-600-mm large-size rectangular-> square panel. Lewis Kang, the Managing Director of the Future Technology Planning Division gave a talk titled “FOWLP-based antenna in package (FO-AiP) using 5G mmWave) on June 3, the last day of the event. Kang introduced the antenna-in-package technology, which can reduce signal loss in 5G smartphone communication antennae using Nepes’ noteworthy fan-out technology.  “We promoted Nepes’ unique PLP and AiP technology for 5G use at the international ECTC conference, which is attended by semiconductor experts from all over the world alongside possible clients,” said Kang. “We paved the way for future discussions regarding new business developments with possible global, top-tier clientele attending the conference.”

2022-06-14

Nepes, which eliminated semiconductor leadframe, “semiconductor packaging efficiency 10 times… Achie

Nepes, which eliminated semiconductor leadframe, “semiconductor packaging efficiency 10 times… Achieved 1 trillion won in sales within 3 years”Semiconductor manufacturing is divided into a ‘pre-process’, in which a circuit is engraved on thin silicon to manufacture a chip, and a ‘post-process’, in which the manufactured chip is packaged (packaging) using a substrate and metal wire. Nepes a company specializing in semiconductor backend-processing, recently started produce the 'Fan-out panel level packaing'(FOPLP) that packaged high-performance semiconductors with a thickness of 0.9nm and works in the form of a square panel(600mm) It is the only technology in the world that increases the net die (the number of chips per wafer or panel) more than tenfold from 1,000 to 10,000. Since there is no wasted area on the edge of the circular wafer, productivity is also greatly improved. Lee Byung-koo (pictured), chairman of Nepes, said, “We are pushing the semiconductor packaging technology to the limit through FOPLP and others." Nepes, a listed company on the KOSDAQ, is a cutting-edge company in the packaging field. They mainly receive chips from Samsung Electronics, etc., and package them to complete semiconductors. It has the capacity to process 1104,000 wafers per year. Sales are 65% export and 35% domastic. Last year, it recorded 418.4 billion won in sales and 16.4 billion won in operating loss. Nepes has been developing a technology for packaging chips to be light, thin and short (light, thin, short and small) so that semiconductors can be put into smartphones and IoTs. In the past, semiconductors were shaped like a black centipede. Its size was much larger than the chip. This is because the chip was placed on the board, a connection part similar to a centipede was made using a copper wire, etc., and then an epoxy resin was placed on it to fix it. Due to its complex structure, the heat problem was also serious. In contrast, the semiconductors packaged by Nepes do not change significantly in the size of a square chip. This is because they developed 'Wafer Level Packaging (WLP)' technology in the 2000s, which coats a thin metal film just below the chip, prints a circuit diagram with a laser, and sends and receives electrical signals using fine metal protrusions. The thickness of the finished semiconductor was only 0.4 nm. Overseas semiconductor manufacturers that have recognized Nepes' technology have sent their chips by air to request packaging. Nepes, which eliminated semiconductor centipedes, “semiconductor packaging efficiency 10 times… Achieved 1 trillion won in sales within 3 years” Nepes spares no expense in R&D and facility investment to maintain cutting-edge technology. Last year, an additional 42,962㎡ factory site was prepared in Goesan, North Chungcheong Province, and advanced packaging facilities such as WLP and FOPLP were installed. Last year's operating loss is related to such facility investment.  Nepes' earnings are expected to improve significantly this year. This is because the total production capacity will increase by about 60% when the FOPLP facility starts operation. The securities industry predicts that Nepes will record 606 billion won in sales and 52 billion won in operating profit this year. This is almost twice as much sales as in 2020 (343.6 billion won).

2022-05-09

Nepes wins the ESG Management CEO Grand Prize

Nepes won the ESG Management CEO Grand Prize (Corporate Governance Sector) at the ‘2021 ESG Management Awards Ceremony and Best Case Presentation’ held at the National Assembly Hall conference room on December 15th.This event was co-hosted by the Office of National Assembly member Joo-Young Kim and the Audit and Sharing Research Institute, and was prepared to further vitalize and encourage ESG management, which is indispensable in corporate activities.The organizer selected the ESG management target awardees based on the company's sustainability report, and included 9 environmental indicators such as general energy consumption, renewable energy consumption, and greenhouse gas emissions, and 12 other environmental indicators including employee safety, win-win growth support for business partners, and support for local communities. Each of the nine governance indicators, such as social indicators, management performance evaluation and compensation, identification of stakeholder ESG needs, and participation in global partnerships, was scored and evaluated. Nepes Chairman Lee Byung-koo was selected as the best CEO in the corporate governance sector and received this award.

2021-12-22

Nepes Laweh set new industry benchmark with 600mm large panel M-Series fan-out volume production

Nepes Laweh corporation announced the successful production qualification and ramp-up of the world’s first 600mm x 600mm large panel manufacturing line using Deca’s M-Series™ fan-out technologies.   Nepes Laweh held the completion ceremony of the Cheongan Campus PLP Line on December 7th with the presence of Minister of Trade, Industry and Energy, Governor of Chungcheongbuk-do, and representatives of customers and partners. The company announced that the FOPLP line completed customer certification in the third quarter and secured a stable yield and entered full-scale mass production.   The PLP fab, which held the completion ceremony this time, was the first fab built on the 186,000㎡ Cheongan Campus site with 25 soccer fields, and was a total building area of 34,000㎡. This is a level that can produce up to 96,000 panels per year based on 600mm PLP. Based on this next-generation manufacturing line, Nepes is evaluated to be able to provide high-density packaging solutions required for advanced system semiconductors for each application, such as smartphones, automobiles, and IoT, according to customer needs. "FOPLP is the best packaging solution for high-end semiconductors as a result of long cooperation with global partners such as materials, parts, and equipment," said Chilhee Chung, Chairman of Nepes and GM of Semiconductor Business   “We’re pleased to be working with nepes to bring the industry’s largest format 600mm square panel to volume production” commented Tim Olson, CEO of Deca. “With initial production focused on single and multi-die packages for leading Smartphone producers, the future is heterogenous integration of chiplets using Deca’s Gen 2 technology.  A recent customer application with 10 embedded chiplets was designed into a 36mm x 36mm package.  Such a large device is limited to 73% maximum utilization on 300mm round format due to edge losses.  On 600mm, the utilization jumps to 92% delivering greater than 25% cost reduction on area utilization alone.”    About Nepes Laweh www.nepes.co.kr Nepes Laweh is leading company in the system semiconductor industry with advanced fan-out packaging solution. In the era of the 4th industrial revolution, when semiconductors are refined and advanced, such as 5G, self-driving cars, and smartphones, we are presenting new standards for fan-out packages based on nPLP™ technology using 600mm large square panels.   About Deca Technologies www.ThinkDeca.com   Deca is a leading provider of advanced packaging technology to the semiconductor industry with M-Series™ fan-out and Adaptive Patterning® real-time design-during-manufacturing. A growing list of industry leaders have completed technology transfer and license agreements for access to Deca’s proven structures, processes, materials, equipment, design systems and know-how.  Starting with the highest quality and reliability in Gen 1 aimed at Smartphone applications to the growth of Gen 2 for chiplets and heterogeneous integration, Deca’s technologies are emerging as key industry standards for the future.

2021-12-09

Nepes Laweh started Volume Production of ‘FOPLP’, a next-generation packaging solution

- Stable yield achievement of 600mm FOPLP Fab at Cheongan Campus ... Mass production ramp-up - The world's first large-panel packaging process enabling significant productivity improvement and more accessibility to 'advanced technology'   Nepes Laweh announced that it will more than double its capacity next year as it begins mass production of FOPLP, the next-generation packaging process.   Nepes Laweh held the completion ceremony of the Cheongan Campus PLP fab on December 7th with the presence of Minister of Trade, Industry and Energy, Governor of Chungcheongbuk-do, and representatives from customers and partners. The company announced that the FOPLP manufacture line completed customer certification in the third quarter and achieved a stable yield and started full-scale mass production and plans to more than double its capacity next year aligned with strong customer demand.   The PLP Fab, where the completion ceremony was held, was the first fab built on the 186,000㎡ Cheongan Campus site which is the size of 25 soccer fields: with a total building area of 34,000㎡. The fab can produce up to 96,000 panels per year based on 600mm PLP.   Based on this next-generation packaging line, nepes would receive a favorable evaluation about her ability to provide high-density packaging solutions required for Non-memory semiconductors for each application, such as smartphones, automobiles, and IoT, aligned with customer needs. "FOPLP is the best packaging solution for high-end semiconductors as a result of long cooperation with global partners such as materials, parts, and equipment," said Chilhee Chung, Chairman of Nepes and GM of Semiconductor Business   According to the industry, nepes laweh's FOPLP is a large square panel with a size of 600mm by 600mm, and it is analyzed that productivity has greatly improved compared to the 300mm round FOWLP. In particular, the fan-out technology applied to Nepes Laweh’s FOPLP has been proven to have high stability compared to existing technologies.   As demand increases mainly from advanced semiconductor manufacturers in the future, its market share is expected to significantly increase in the overall packaging market.   About Nepes Laweh Nepes Laweh is leading company in the system semiconductor industry with advanced fan-out packaging solution. In the era of the 4th industrial revolution, when semiconductors are refined and advanced, such as 5G, self-driving cars, and smartphones, we are presenting new standards for fan-out packages based on nPLP™ technology using 600mm large square panels.    

2021-12-07

[ESG Report] Nepes that 70% of employees donate and 80% of waste is recycled

Nepes, a semiconductor back-end service(OSAT) company, is strengthening ESG(environmental, social, and governance) management centering on the management philosophy of Chairman Lee Byung-koo. All employees are participating in social contribution activities under one of the corporate management philosophies, ‘Volunteer life’. In addition to the existing semiconductor back-end service business, Nepes is advancing into eco-friendly businesses such as secondary battery parts business, while steadily increasing the recycling rate of waste and paying special attention to reducing environmental pollutants.◇ 80% of employees are local talents… Social contribution activities continue every yearChairman Lee Byung-koo, who founded Nepes in 1990, believed that coexistence with society is essential for a company to grow continuously. Chairman Lee's management philosophy is that just as the water in a pond rots when it accumulates, the company's internal funds must also be channeled toward society. In particular, he emphasizes the voluntary social contribution activities of his employees, saying, "It is more important for many employees to participate than to make a large donation amount." Lee Byung-koo, Chairman of Nepes. /Nepes provided‘n Nanum Seed’, a social contribution activity of Nepes, contains Chairman Lee’s management philosophy. n Nanum Seed, launched in 2009, is an in-house donation system based on a one-to-one matching grant, in which the company also adds the same amount to the amount donated by employees. As executives such as Chairman Lee joined, the participation rate of general employees is also high. According to Nepes, 920 employees signed up as of December last year, and the subscription rate is over 70%. The amount of donations has also steadily increased year by year, and the donation amounted from 16.88 million won in 2016 to 246.78 million won last year, more than doubled in five years.Nepes delivers the funds collected through n Nanum Seeds to local groups and individuals every month. In addition to treatment and surgery expenses for economically difficult patients, it provides subsidies for the elderly and disabled households living alone. In addition, through the volunteer club organized by employees voluntarily, mentoring exchanges with students who grow up in difficult environments, briquette delivery, and kimchi delivery activities are continued every year. An official from Nepes said, "In the second half of this year, to celebrate the 31st anniversary of the foundation, we plan to donate the thank-you piggy bank collected by our employees to 31 individuals, institutions and organizations."Nepes is also contributing to the local community by creating jobs. The number of employees increased from 758 in 2018 to 1,269 this year under Chairman Lee's management philosophy that the existence value of the company is 'job creation'. In particular, it is evaluated that it has contributed greatly to creating local jobs by hiring more than 80% of all employees as local talents. After receiving the Presidential Citation in the ‘local job creation’ sector in 2017, Nepes was also selected as an excellent employment company by Chungbuk Province this year. The long-term goal is to increase the number of employees to 10,000.Nepes employees in volunteer work. /Nepes provided◇ Waste recycling rate increased from 40 to 80% in 5 yearsNepes also takes the lead in preserving the local environment through waste treatment and recycling. In general, since the semiconductor industry uses a vast amount of purified water in the manufacturing process, a large amount of waste is inevitably generated. Nepes has established an advanced waste treatment system to recycle a significant portion of waste generated in the process. In 2018, the recycling rate of waste in Nepes was only 40%, but thanks to steady technological development, it increased to 80% last year. Only 800 tons (t) of waste are recycled annually.Nepes plans to increase the recycling rate to 100% by spurring waste treatment research and development. In July, it was also selected for the government's clean factory development project and decided to conduct wastewater recycling research and development by 2023 together with the Korea Testing Laboratory (KTL). It took on the role of securing the raw water quality database (DB) by applying the wastewater treatment plant of Abspiel, an industrial filter manufacturer, to the manufacturing process.The ns3 campus of Nepes located in Cheongan, North Chungcheong Province. /Nepes providedAs the electric vehicle (EV) market is growing rapidly following the recent energy storage system (ESS), Nepes plans to increase its investment in ‘lead tab’, a key component of secondary batteries. The lead tab film is a kind of 'passage (terminal)' through which the secondary battery sends electricity to the outside, and is one of the essential parts for secondary batteries. An official from Nepes said, “According to the global energy conversion trend, the secondary battery industry is inevitably ahead of growth.Nepes also showed a strong will for the eco-friendly business by increasing the proportion of the lead tap business. It plans to break up with the existing display touch screen panel business centering on its subsidiary, Nepes Yahard, and focus on the production of lead tab film. Last year, the annual sales of Nepes' rechargeable battery business recorded 11.9 billion won, up 55% from the previous year. The lead tab film produced by Nepes Yahard is supplied to large companiesSource: https://biz.chosun.com/industry/company/2021/09/05/Y5GUXNMS3JCUPBD4TBP2TPEVJ4/

2021-09-05

nepes announces 'nSiP', advanced packaging technology without using the PCBs

-nepes announced substrate-less SiP(System in Package) in the Electronic Components and Technology Conference(ECTC)-The industry is giving attention to nepes SiP as an alternative solution for the PCB replacement… Reliability test completed Recently, due to an unprecedented PCB shortage used for semiconductor packaging, the market is interested in SiP solutions based on FOWLP and FOPLP technologies. Nepes, the advanced back-end foundry, promoted substrate-less SiP technology through ECTC and started to target the market. 'nSiP (nepes System in Package)', unveiled by Nepes, is a leading-edge technology of the system semiconductor packaging roadmap. nSiP is based on ‘End-fab’ technology without board and wire bonding and is the most optimized packaging solution for high performance, high density, and small form factor. Also, nSiP is deployed with redistribution layers on a chip instead of PCBs. It allows to reduce the overall size of IC by 30 percent, the thickness by around 60 percent, and the development period by more than 50 percent. The company recently released sample products of packaging to customers across the globe. While semiconductor manufacturers are having difficulties in launching and developing products due to a shortage of substrate and PCB supply, nepes is about to mass-produce FOPLP based on the End-fab technology. “The PLP and nSiP could meet growing demand for high-performing chips and components by providing a new solution for the need” said Kim Tae-hoon, President Corporate Marketing at Nepes. “It will also help relieve the chronic shortage of substrate in semiconductor industry,” he said.

2021-06-09

nepes participates in Electronic Components and Technology Conference(ECTC) 2021

nepes will participate in the Electronic Components and Technology Conference(ECTC) held online from June 1 to July 4, 2021 and introduce advanced packaging technology based on 'End-fab' technology.ECTC, which marks its 71st anniversary this year, is a worldwide prestigious event in the fields of packaging, electronic components and technology education, and is a place for cooperation and technology exchange in which 106 global semiconductor companies participate.▲nepes Virtual Conference in ECTC▲In-Soo Kang, Head of Future Technology Planning Division, introducing nSiP solutions in the 2021 ECTC Technical Programnepes participated in this event as a conference sponsor and participated in 'nSiP (nepes' System in Package) Platform for Various Module Packaging Applications' (Kang In-soo, Kim Jong-heon, Lee Jun-gyu, Shin Won-sun, Kim Nam-cheol, Park Sang-yong) and 600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' (Jacinta Aman Lim, Park Yoon-mook, Edil De Vera, Kim Byeong-cheol, Brett Dunlap ) will release a presentation video.Event information: https://www.ectc.net■Presentation video  'nSiP(System in Package) Platform for Various Module Packaging Applications' :  https://youtu.be/-i0k_kHHGJU'600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' : https://youtu.be/zskiFK--8gQ■BrochurenSiP : https://url.kr/1yfwnenPLP : https://url.kr/6plyox

2021-06-03

「基板なし」が主流に("No board" is the mainstream - Japan, The Daily NNA

「基板なし」が主流に  一方で、基板不足の影響を受けていないパッケ?ジ? 門メ?カ?もある。  韓?のネぺスは、基板を使わずにウエハ??態のまま で最終工程まで?理できる技術を持つ。ネペスは今年１ 月、この「ウエハ?レベルパッケ?ジ」技術を生かし て、ＣＰＵやメモリ?など複?のチップを?一のパッケ ?ジに形成してシステム化を?現する「システム?イ ン?パッケ?ジ」技術を公開した。基板とワイヤを用い る??方法に比べ、??面積を３分の１以下に縮小でき るメリットがあるという。  システム?イン?パッケ?ジ技術は、複?個の集積回 路（ＩＣ）またはパッケ?ジを積層することで、メモリ ?の大容量化や機能の複合化を?現する??技術。現在 は、スマホの主要部品の 73％がシステム?イン?パッケ ?ジで構成されているが、そのうちの９割は基板やワイ ヤを使った??方式のため、同技術の伸びしろは大き い。  (the rest omitted)"No board" is the mainstream.There is a package maker where have not been affected by the shortage of substrates.Nepes in Korea has the technology to process from wafer to packaging without using a substrate.In January of this year, Nepes unveiled the "System in Package" technology  by using  "Wafer Level Package" technology."System in Package" technology forms a single package of multiple chips such as CPU and memory and realizes systematization.It has the advantage of reducing the mounting area by less than one-third compared to the conventional method using a substrate and wire.(the rest omitted)[Source = Japan, The Daily NNA    https://bit.ly/3eF8QzM]

2021-04-27

Nepes, visited an amusement park with members of the disabled orchestra

On May 31, Nepes visited an amusement park with members of the Nepes Disabled Orchestra 'Lua Chamber'.This 'Happy Together Outing' was designed to give warm memories to the members of the Rua Chamber, and they had a pleasant day wearing orange tees and riding rides.The Lua Chamber Orchestra consists of eight people who are disabled people employed by Nepes. They will hold an opening ceremony at the end of June and will carry out activities to spread the Nepes corporate culture based on music management both inside and outside.

2022-06-08

Nepes was introduced <The Fruit of Love> In the March issue.

▲Kim Nam-Chul, president of the semi BU, who participated in the cover model of <Fruit of Love>, Nepes staff Yoon Han-Gyeol, Im Ye-Won.Nepes was introduced in the March issue of The Fruit of Love, a monthly edition of the Love Fruit Social Welfare Community Chamber.The fruit of love is a public institution established in 1999, and it plays the role of supporting neighbors and small and medium social welfare organizations that need help through regular fundraising.It publishes the monthly sharing magazine "The Fruit of Love", and contains sharing issues in each region such as its own events, donors, and donation companies.In this March issue, Nepes was introduced as a representative company with a beautiful corporate culture in the Chungcheongbuk-do area.Nepes has been carrying out various social contribution activities linked to local communities and organizations under the philosophy of sharing management by Chairman Lee Byung-Koo.In particular, we donate some of the donations of 'n Sharing Seed', which is operated by 'Matching Grant Fund', to the fruits of love every month.'School Project', 'Children's Family Counseling Room', 'Covid 19 Support', 'Kimchi Dipping of Love', 'One-person Household Care Service'In the meantime, Nepes has introduced various sharing activities in <The Fruit of Love>.E-book t: https://nanumnews.or.kr/ebook/2203/

2022-04-20

Nepes signed an agreement to promote disabled employment with the KEAD

Nepes signed an agreement with the Korea Employment Agency for Persons with Disabilities(KEAD) for the Disabled to promote employment of the disabled on the 28th in the creative room of the ns2 campus. The signing ceremony was attended by Park Hyung-gun, president of management support, and Cha Jeong-hoon, director of employment promotion of the KEAD, and agreed to cooperate to create and support high-quality jobs for the disabled. According to the signing of this agreement, Nepes plans to establish and gradually expand an orchestra composed of members with disabilities to support job creation in the field of culture. 

2022-03-29

Nepes launches ESG campaign with 'Good Cycling'

Nepes has been campaigning for 'Good Cycling' for two weeks from March 7 to 18.The Good Cycling Campaign was prepared to encourage Nepes staff to participate voluntarily by emphasizing the effect of job creation and recycling of disabled people through product donations.This is not used by 40 staff, but it has donated 916 items including clothing, miscellaneous items, and household appliances that can be reused. The donated items were delivered to the MIRAL Welfare Foundation Good Will Store.The Good Will Store is a place that sells and reuses items donated by individuals and companies and supports resource cycles, and 273 disabled people are working in 13 stores.The goods Nepes donated through this campaign will be sold at the Daejeon and Gangnam stores, and the proceeds from sales will be used for salary support purposes for disabled employees. Nepes has been doing Goodwill Store goods donation activities since the last 2019 and continues to cooperate with the disabled for expanding employment and resource circulation.

2022-03-20

Nepes and Nepes Ark donated 60 million won in relief donations for Ukraine and wildfire damage

On the 14th, Nepes and Nepes Ark donated 60 million won to support international emergency relief activities caused by the Ukrainian war and support the Gangwon-do and Gyeongsangbuk-do wildfire damage.Nepes donated 30 million won to the Korean Red Cross to support Ukraine's emergency relief activities, and Nepes ark donated a total of 30 million won to the Korea Disaster Relief Association, including 5 million won of n-sharing seed, to support the forest fire damage area. In addition to this donation, Nepes has participated in sharing activities to support domestic and overseas disaster damage such as support for the volcanic eruption in the Philippines and prevention of the spread of COVID-19 in 2020 through "n sharing seeds" which is operated in a matching grant method.

2022-03-16

Nepes joins the The Red Cross Creating Shared Value(RCSV)

Nepes announced that it had participated in the 'The Red Cross Creating Shared Value(RCSV)' induction ceremony at 14:00 on the 28th (Tuesday) at the lobby of the Chungbuk branch of the Korean Red Cross.The Red Cross Creating Shared Value (RCSV), a corporate organization operated by the Korean Red Cross, is a socially shared value platform that systematizes Red Cross humanitarian and corporate social contribution activities.On this day, Nepes President Kim Nam-cheol, Sunwoo Chemtech CEO Cha Tae-hwan, and Korea Ceramics Co., Ltd. Managing Director Kim Nam-cheol attended the signing ceremony and took a commemorative photo, and delivered the sign-up plaque and name plate. Inducted into the Chungbuk Governor Hall of Fame.Nepes, a global semiconductor component manufacturer, has 'a life of service, a challenging attitude, and a grateful heart' as its key management philosophy, and continues to make efforts for the underprivileged in welfare blind spots such as voluntarily participating in sharing and contribution activities.

2021-12-28

Nepes, supports the contactless online bazaar to treat infants with disabled children

On May 24, Nepes delivered donations for the treatment of children with disabilities through the MIRAL Welfare Foundation. The Contactless online auction bazaar was held from April 25 to 30 to mark Family Month in May. It was conducted by taking pictures of goods using the Yammer community tool and presenting prices in comments.A total of 48 items, including small home appliances, backpacks, and golf clubs, were registered at the bazaar, achieving a total profit of 1,043,400 won.Nepes raised a total of 2,086,800 won in donations under the 1:1 matching grant fund system for companies and staff and donated it to the MIRAL Welfare Foundation to support treatment costs for children with disabilities. 

2021-05-25

Nepes staff, donated 3 million won through the ‘walk donation campaign’

Nepes ran the walk donation campaign 'Miracle Walker' for a week since November 23rd to improve staff health and support medical expenses for disabled children.The campaign was conducted in a matching grant fund system in which the company donated 3 million won when Nepes staff achieved 3,000 steps a week, and they achieved 161% of the target steps and delivered 3 million won through the MIRAL Welfare Foundation. Another staff said, "it was amazing, fun, and rewarding to know that there was a donation that could be participated without any material or talent, it was good to be able to walk exercise these days, which is colder than anything else."Also, Nepes is planning to start various contactless volunteer activities like this campaign in 2021 to overcome COVID-19. 

2020-12-08

Nepes donated 100 million won in COVID-19 to the Daegu Community Chest of Korea

Nepes contributed 100 million won to the Daegu Community Chest of Korea on the 3rd to prevent the spread of COVID-19 and overcome the crisis. Chairman Lee Byung-Koo said, "We have gathered our hearts to send a small comfort in a difficult time." "It is a hard time, but we hope Daegu citizens will overcome the crisis with one heart."The donation to the Daegu Community Chest of Korea will be used for low-income residents in Daegu suffering from COVID-19, including COVID-19 prevention supplies and medical support. Also, Nepes is collecting voluntary donations from staff for residents of the Chungcheongbuk-do affected by the prolonged COVID-19. 

2020-03-10

Nepes, supports dust masks to nepes hayyim, and does good deeds within a group

   On March 3rd, Jiangsu nepes provided 6,000 dust masks for free to nepes hayyim, a Philippine production Corporation.Recently, COVID-19 has unstable the supply and demand of dust masks at the Philippine plant. In response to this issue Jiangsu nepes decided to provide 6,000 masks after an urgent discussion with nepes hayyim. Kim Nam-chul, President of the semiconductor BU, thanked Jiangsu nepes and said, "Thank you for giving your full support and prompt response at a time where each country is facing hardships with unstable mask supplies." Meanwhile, last February, Nepes passed on the 10,000 masks to Huai'an City, Jiangsu Province, China through Jiangsu nepes. And Jiangsu nepes did a good deed for nepes hayyim again.

2020-03-05