System in Package (SiP)
개별 칩들을 단일 패키지로 결합시킨 초박형, 고집적 토탈 패키징 솔루션입니다.
nePAC™ Solutions
SiP is wafer level & chip last(RDL first) based System in Package solution where multi RDL & double side mounting is possible.
nePAC™(nepes Package in Advanced CX solution) offers more compact & slimmer feature compared to substate base SiP
Product View
| VALUE | |||||
|---|---|---|---|---|---|
cx-CSP / BGA |
cx-EDP (Embedded Die Package) |
cx-PoP (Package on Package) |
cx-AiP (Antenna in Package) |
cx-CLP (Chiplet Package) |
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| Product View |  |
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| Features |
Single or Multi-chip integration - Active & Passive |
Chip-first & Chip-last combined |
Package stackable Cu-post & Double-side RDL |
RDL patterned antenna |
RDL interposer + Si bridge |
| Application | Communication Consumer, Automotive, Industrial, (RFFE, Wireless connectivity, mmWave, Wearable, Sensor, Power, IoT) |
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nepes corp.
Address충청북도 청주시 청원구 오창읍 과학산업2로 587-32
Tel043-240-8500(내선2번)