System in Package (SiP)
개별 칩들을 단일 패키지로 결합시킨 초박형, 고집적 토탈 패키징 솔루션입니다.
nSiP Solutions
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- Semi. IC
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- Highly integrated package
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- Unlimited devices
nSiP Feature
Small size and thin profile → System design flexibility
High speed → High I/O density, Fine pitch L/S, Short interconnection path
High power dissipation & Lower power consumption → Short thermal path
* Cost effective wafer level batch process
Product View
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- RF nSiP
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- nSiP Optical
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- nSiP Stack
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- nSiP CiB (Chip in board)
What is SiP
Multiple active electronic component with different functionality in a single unit
Multiple functions associated with system or sub system
SiP may optionally contain passive, mems sensor, optical component, and other packages and devices.
Cost effective solution
nepes corp.
Address충청북도 청주시 청원구 오창읍 과학산업2로 587-32
Tel043-240-8500(내선2번)