Flip-Chip Bumping
종래 금속선 대신 전도성 범프를 이용해 연결하는 첨단 패키징 솔루션입니다.
Flip-Chip Bumping Solutions
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- Bumping
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- Wafer Test
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- Back Grinding & Sawing
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- Assembly (COF)
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- Final Test (COF)
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- Final Product
Back-end Assembly includes Back-Grind, Laser Mark, SAW, ILB, POT
Product View
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- Gold Bumping DETAIL VIEW
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- Solder Bumping DETAIL VIEW
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- Cu Pillar Bumping DETAIL VIEW
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- Customized Bumping
nepes corp.