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BUSINESS

GLOBAL TOP-TIER PARTNER, NEPES

Wafer Level Package (WLP)

웨이퍼를 자르지 않고 범핑과 재배선(RDL) 하는 기술로,
칩의 경박단소를 위한 최적의 첨단 패키징 솔루션입니다.

Wafer Level Packaging Solutions

nepes Wafer Level Package (WLP) portfolio includes wafer bumping, wafer level probe test to support full turn-key solutions

nepes provides low cost solution with high reliability/technology to meet the dramatic demand in various applications

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Product View

VALUE FIWLP
Product View
Wafer Size 200mm & 300mm
Advantages ▣ Meets JEDEC MSL1 CLR and BLR requirements
Features

  • Thin profile and small size

  • High reliability

  • Smaller pitch & Higher density of I/Os

  • Shorter interconnect/Higher speed

  • Lower power consumption/thermal resistance

  • Lower packaging/test cost
Application Communication, Consumer, Automotive,
(PMIC, DC converter, Wireless charging IC, Display/Driver IC, Audio Codec, Transceivers, Connectivity Module)

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