Wafer Level Package (WLP)
웨이퍼를 자르지 않고 범핑과 재배선(RDL) 하는 기술로,
칩의 경박단소를 위한 최적의 첨단 패키징 솔루션입니다.
Wafer Level Packaging Solutions
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- RDL
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- Bumping
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- Wafer Test
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- Back Grinding & Sawing
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- Final Product
nepes Wafer Level Package (WLP) portfolio meets the dramatic demand with full turn-key solutions.
The current product applications are power management IC, Codec, Touch screen controllers, DDI, System ICs in Mobile and Automotive.
Product View
| VALUE | FIWLP |
|---|---|
| Product View |  |
| Wafer Size | 200mm & 300mm |
| Features |
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nepes corp.
Address충청북도 청주시 청원구 오창읍 과학산업2로 587-32
Tel043-240-8500(내선2번)