Wafer Level Package (WLP)
웨이퍼를 자르지 않고 범핑과 재배선(RDL) 하는 기술로,
칩의 경박단소를 위한 최적의 첨단 패키징 솔루션입니다.
Wafer Level Packaging Solutions
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- RDL
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- Bumping
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- Wafer Test
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- Back Grinding & Sawing
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- Final Product
nepes Wafer Level Package (WLP) portfolio meets the dramatic demand with full turn-key solutions.
The current product applications are power management IC, Codec, Touch screen controllers, DDI, System ICs in Mobile and Automotive.
Product View
nepes corp.
Address충청북도 청주시 청원구 오창읍 과학산업2로 587-32
Tel043-240-8500(내선2번)