Wafer Level Package (WLP)
웨이퍼를 자르지 않고 범핑과 재배선(RDL) 하는 기술로,
칩의 경박단소를 위한 최적의 첨단 패키징 솔루션입니다.
Wafer Level Packaging Solutions
nepes Wafer Level Package (WLP) portfolio includes wafer bumping, wafer level probe test to support full turn-key solutions
nepes provides low cost solution with high reliability/technology to meet the dramatic demand in various applications
Product View
| VALUE | FIWLP |
|---|---|
| Product View |  |
| Wafer Size | 200mm & 300mm |
| Advantages | ▣ Meets JEDEC MSL1 CLR and BLR requirements |
| Features |
|
| Application | Communication, Consumer, Automotive, (PMIC, DC converter, Wireless charging IC, Display/Driver IC, Audio Codec, Transceivers, Connectivity Module) |
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