By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.
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[원문보기 = The Korea Times http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]