GLOBAL TOP-TIER PARTNER, NEPES
| 날짜 | 공시제목 | 제출인 | 2023-03-23 | 사업보고서 (2022.12) | 네패스 | 2023-03-23 | 감사보고서제출 | 네패스 | 2023-03-22 | 기타경영사항(자율공시)(감사보고서 제출 지연) | 네패스 | 2023-03-14 | 주주총회집중일개최사유신고 | 네패스 | 2023-03-14 | 주주총회소집결의 | 네패스 | 2023-03-14 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 네패스 | 2023-03-14 | 주주총회소집공고 | 네패스 | 2022-12-15 | 주주명부폐쇄기간또는기준일설정 | 네패스 | 2022-11-24 | 금전대여결정 | 네패스 | 2022-11-14 | 분기보고서 (2022.09) | 네패스 |
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By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.
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[원문보기 = The Korea Times http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]
