GLOBAL TOP-TIER PARTNER, NEPES
| 날짜 | 공시제목 | 제출인 | 2023-08-17 | 금전대여결정 | 네패스 | 2023-08-14 | 반기보고서 (2023.06) | 네패스 | 2023-07-25 | 타인에대한채무보증결정 | 네패스 | 2023-07-06 | 타인에대한채무보증결정 | 네패스 | 2023-06-09 | 임원ㆍ주요주주특정증권등소유상황보고서 | 이창우 | 2023-05-15 | 분기보고서 (2023.03) | 네패스 | 2023-05-09 | 연결재무제표기준영업(잠정)실적(공정공시) | 네패스 | 2023-03-30 | 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 네패스 | 2023-03-30 | 정기주주총회결과 | 네패스 | 2023-03-23 | 사업보고서 (2022.12) | 네패스 |
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By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.
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[원문보기 = The Korea Times http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]
