Nepes, led by CEO Byung-Koo Lee, participated in the inaugural '2023 Advanced Semiconductor Packaging Show’ upon invitation from Samsung Electronics' AVP (Advanced PKG) business team.

▲ Kang In-soo, Executive Director, explaining Nepes' advanced packaging technology to the visitors. (Photo= Nepes)

With the advanced semiconductor process facing significant costs and technical challenges, packaging technology to enhance chip performance is gaining attention. Last year, Samsung established an AVP (AdVanced Packaging) team to nurture advanced packaging and strengthen collaboration with technically capable partners. Having provided advanced packaging services since 2000, Nepes, as a core partner of Samsung, was invited to this exhibition, where they introduced their expertise through high-quality WLP processes, FOPLP, and the ultra-compact SiP, nePAC, captivating attendees' attention.

Co-hosted by Suwon City and Gyeonggi Province, the '2023 Next-Generation Semiconductor Packaging Equipment and Materials Industry Exhibition', the first post-process specialized semiconductor exhibition in Korea, opened on the 30th and will run for three days at the Gyeonggi Suwon Convention Center, ending today(9/1).