Full Turn-key Solutions of
Bumping, WLP, FOWLP/PLP, SiP and Test
nepes is a leading-edge provider of Wafer Level Packaging, providing full turnkey solutions that include 8” & 12” Flip-chip bumping
and Test nepes provides an extensive range of packaging options such as, WLCSP, FOWLP/PLP/PoP, SiP as well as 2.5D/3D
modules without conventional substrates. nepes has also been the first 600mm x 600mm Fan-Out PLP OSAT in the world in high
volume production since September 2021, and strengthened its Fan-Out packaging portfolio by licensing M-Series™.
nepes operates Back-end foundry in Korea, Philippines, China to meet the dramatically increasing demand of advanced packages
from global fabless and IDM customers with innovative packaging leadership.
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nepes’ semiconductor market positioning
