Full Turn-key Solutions of
Bumping, WLP, FOWLP/PLP, SiP and Test
nepes
offers Advanced Assembly & Test manufacturing services including wafer bumping, WLP and SiP technologies for our global fabless and integrated device manufacturer customers. Our full turn-key services additionally offer design, characterization, back-end processing, and electrical test.
nepes
uses its cutting-edge manufacturing process technologies to reinforce the portfolio of its products: WLP, fan-out WLP, fan-out WLSiP, advanced fan-out PLP, and 2D, 3D modules.
nepes
operates fabs in Cheongju and Cheongan in Chungcheongbuk-do, Manila, Philippines, and Jiangsu, China and listens to the voices of its customers at home and abroad while operating overseas offices in San Diego, USA and Shanghai, China.
nepes’ semiconductor market positioning
Market & Applications
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Consumer
IoT, TV, Monitor, Laptop,
Smartphone, Tablet, Wearable
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Industrial
AI, Data center
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Automotive
ADAS, Chassis, Infotainment,
Safety, Powertrain
