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COMPANY

NEPES, GLOBAL TOP-TIER PARTNER

ns 3 delivers

BEYOND
CUSTOMER
REQUIREMENT

thru AI platform

Located in Cheongan, Chungcheongbuk-do, ns 3 campus (nepes laweh) is the starting point of nepes's road map for the acceleration of growth in the field of global system semiconductor. We will accomplish the mission of nepes a "company to deliver beyond the customer requirements through the cutting-edge AI factory to be established in the campus."

Year of Construction 2020
Lot Area 186,271
네패스 내부 이미지
  • PRODUCTION
  • QUALITY
  • SECURITY
  • LOGISTICS

Mecca of System Semiconductor
Cheongan Campus

Cheongan Campus is the world’s first packaging foundry fab where the mass production of 600mm FOPLP is available. In the age of Cheongan, nepes leads the new semiconductor package ecosystem that it will face in this era of new normal, providing customized turn-key solutions of FX series.

반도체 이미지

nepes's AI FACTORY solution

nepes is making efforts to reinforce its digital competitiveness with the AI factory strategy, wherein its accumulated cutting-edge know-how on semiconductor packaging is converged with the technologies of IoT, big data, and AI.

Test Automation
AI Vision inspection
Integrated Security System
AI CCTV
Semiconductor Process Control
AI Laser marking
Plating Solution Monitoring
Moving Path Tracking
Logistics
Equipment Operation
Safety Distance
AI Packing inspection

Cheongan Campus

  • AddressSan 13-1, Jocheon-ri, Cheongan-myeon, Goesan-gun, Chungcheongbuk-do

  • Tel+82-43-240-8500 (trunk line)

  • Fax+82-43-833-9490

Management Support Division

Panel Level Package(nepes laweh)

Divisions of Semiconductor Sales, Marketing, and Quality