BEYOND
CUSTOMER
REQUIREMENT
thru AI platform
Located in Cheongan, Chungcheongbuk-do, ns 3 campus (nepes laweh) is the starting point of nepes's road map for the acceleration of growth in the field of global system semiconductor. We will accomplish the mission of nepes a "company to deliver beyond the customer requirements through the cutting-edge AI factory to be established in the campus."
-
- PRODUCTION
-
- QUALITY
-
- SECURITY
-
- LOGISTICS
Mecca of System Semiconductor
Cheongan Campus
Cheongan Campus is the world’s first packaging foundry fab where the mass production of 600mm FOPLP is available. In the age of Cheongan, nepes leads the new semiconductor package ecosystem that it will face in this era of new normal, providing customized turn-key solutions of FX series.
nepes's AI FACTORY solution
nepes is making efforts to reinforce its digital competitiveness with the AI factory strategy, wherein its accumulated cutting-edge know-how on semiconductor packaging is converged with the technologies of IoT, big data, and AI.
- Test Automation
-
AI Vision inspection
- Integrated Security System
-
AI CCTV
- Semiconductor Process Control
-
AI Laser marking
Plating Solution Monitoring
Moving Path Tracking
- Logistics
-
Equipment Operation
Safety Distance
AI Packing inspection
Cheongan Campus
Address 30, Nepes-ro, Cheongan-myeon,
Goesan-gun, Chungcheongbuk-do-
Tel+82-43-240-0500 (trunk line)
Fax+82-43-240-8375
Management Support Division
Panel Level Package(nepes laweh)
Divisions of Semiconductor Sales, Marketing, and Quality