An optimal cutting-edge packaging solution for lighter, thinner, shorter,
and smaller chips, processing bumping and RDL without cutting the wafer.
Wafer Level Packaging Solutions
- Wafer Test
- Back Grinding & Sawing
- Final Product
nepes Wafer Level Package (WLP) portfolio meets the dramatic demand with full turn-key solutions.
The current product applications are power management IC, Codec, Touch screen controllers, DDI, System ICs in Mobile and Automotive.
|Wafer Size||200mm & 300mm|
Drag it from side to side.