Wafer Level Package (WLP)
An optimal cutting-edge packaging solution for lighter, thinner, shorter,
and smaller chips, processing bumping and RDL without cutting the wafer.
Wafer Level Packaging Solutions
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- RDL
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- Bumping
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- Wafer Test
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- Back Grinding & Sawing
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- Final Product
nepes Wafer Level Package (WLP) portfolio meets the dramatic demand with full turn-key solutions.
The current product applications are power management IC, Codec, Touch screen controllers, DDI, System ICs in Mobile and Automotive.
Product View
| VALUE | FIWLP |
|---|---|
| Product View |  |
| Wafer Size | 200mm & 300mm |
| Features |
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nepes corp.
Address587-32 Gwahaksaneop 2-ro Ochang-eup, Cheongwon-gu, Cheongju-si, Chungcheongbuk-do
Tel+82-43-240-8500 (Line 2)