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BUSINESS

NEPES, GLOBAL TOP-TIER PARTNER

Wafer Level Package (WLP)

An optimal cutting-edge packaging solution for lighter, thinner, shorter,
and smaller chips, processing bumping and RDL without cutting the wafer.

Wafer Level Packaging Solutions

  • RDL
  • Bumping
  • Wafer Test
  • Back Grinding & Sawing
  • Final Product

nepes Wafer Level Package (WLP) portfolio meets the dramatic demand with full turn-key solutions.
The current product applications are power management IC, Codec, Touch screen controllers, DDI, System ICs in Mobile and Automotive.

Product View

VALUE FIWLP
Product View
Wafer Size 200mm & 300mm
Features
  • Meets JEDEC MSL1 CLR and BLR requirements

[Fan-in WLP]

[None-UBM Fan-in WLP]

Drag it from side to side.