An ultra-thin, highly integrated total packaging solution
combining individual chips into a single package.
FOSiP Solutions
SiP is wafer level & chip last(RDL first) based system in package solution where multi RDL & double side mounting is possible.
FOSiP(Fan Out System in Package) offers more compact & slimmer feature compared to substrate-based SiP
Product View
| VALUE | |||||
|---|---|---|---|---|---|
CSP / BGA |
EDP (Embedded Die Package) |
PoP (Package on Package) |
AiP (Antenna in Package) |
CLP (Chiplet Package) |
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| Product View |  |
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| Features |
Single or Multi-chip integration Active & Passive devices |
Top device mounted at package process Cu-post & double-side RDL |
Top device mounted at board assembly Cu-post & Double-side RDL |
RDL patterned antenna |
RDL interposer + Si bridge |
| Application | Mobile, Wearable, Automotive, Industry, Health care... (AP, Memory, Sensor, Optical...) |
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Tel+82-43-240-0500 (Line 3)
E-mailsales@nepes.co.kr