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BUSINESS

NEPES, GLOBAL TOP-TIER PARTNER

System in Package (SiP)

An ultra-thin, highly integrated total packaging solution
combining individual chips into a single package.

nePAC™ Solutions

SiP is wafer level & chip last(RDL first) based System in Package solution where multi RDL & double side mounting is possible.

nePAC™(nepes Package in Advanced CX solution) offers more compact & slimmer feature compared to substate base SiP

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nepes corp.

Address587-32 Gwahaksaneop 2-ro Ochang-eup, Cheongwon-gu, Cheongju-si, Chungcheongbuk-do

Tel+82-43-240-0500 (Line 3)

E-mailsales@nepes.co.kr