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BUSINESS

NEPES, GLOBAL TOP-TIER PARTNER

System in Package (SiP)

An ultra-thin, highly integrated total packaging solution
combining individual chips into a single package.

nSiP Solutions

  • Semi. IC
  • Highly integrated package
  • Unlimited devices

nSiP Feature

  • Compact & Robust SiP

  • High performance
    Embedded trace substrate
    (RF performance)

  • EMI shielding structure

  • Cost effectiveness
    Time to market Solution

  • in-line wafer (panel)
    level solution

Small size and thin profile → System design flexibility
High speed → High I/O density, Fine pitch L/S, Short interconnection path
High power dissipation & Lower power consumption → Short thermal path
* Cost effective wafer level batch process

Product View

  • RF nSiP
  • nSiP Optical
  • nSiP Stack
  • nSiP CiB (Chip in board)

What is SiP

  • Multiple active electronic component with different functionality in a single unit

  • Multiple functions associated with system or sub system

  • SiP may optionally contain passive, mems sensor, optical component, and other packages and devices.

  • Cost effective solution