An ultra-thin, highly integrated total packaging solution
combining individual chips into a single package.
nSiP Solutions
-
- Semi. IC
-
- Highly integrated package
-
- Unlimited devices
nSiP Feature
Small size and thin profile → System design flexibility
High speed → High I/O density, Fine pitch L/S, Short interconnection path
High power dissipation & Lower power consumption → Short thermal path
* Cost effective wafer level batch process
Product View
-
- RF nSiP
-
- nSiP Optical
-
- nSiP Stack
-
- nSiP CiB (Chip in board)
What is SiP
Multiple active electronic component with different functionality in a single unit
Multiple functions associated with system or sub system
SiP may optionally contain passive, mems sensor, optical component, and other packages and devices.
Cost effective solution
Address587-32 Gwahaksaneop 2-ro Ochang-eup, Cheongwon-gu, Cheongju-si, Chungcheongbuk-do
Tel+82-43-240-8500(Line 2)