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BUSINESS

NEPES, GLOBAL TOP-TIER PARTNER

System in Package (SiP)

An ultra-thin, highly integrated total packaging solution
combining individual chips into a single package.

nSiP Solutions

SiP is wafer level & chip last(RDL first) based System in Package solution where multi RDL & double side mounting is possible.

nSiP(nepes SiP) offers more compact & slimmer feature compared to substate base SiP

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