Flip-Chip Bumping
A state-of-the-art packaging solution using conductive
bump instead of the previously used metal line for connection.
Flip-Chip Bumping Solutions
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- Bumping
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- Wafer Test
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- Back Grinding & Sawing
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- Assembly (COF)
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- Final Test (COF)
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- Final Product
Back-end Assembly includes Back-Grind, Laser Mark, SAW, ILB, POT
Product View
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- Gold Bumping DETAIL VIEW
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- Solder Bumping DETAIL VIEW
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- Cu Pillar Bumping DETAIL VIEW
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- Customized Bumping
nepes corp.
Address116 Gwahaksaneop 3-ro Ochang-eup, Cheongwon-gu, Cheongju-si, Chungcheongbuk-do
Tel+82-43-240-8500 (Line 1)