A micro packaging solution to make smaller, high-function
chips by redistributing I/O terminals outside the periphery of the chip.
- Wafer & Panel Test
- Back Grinding & Sawing
- Final Test
- Final Product
FOWLP Vs. FOPLP
To provide multiple package solutions, high reliability and functionality in a smaller footprint for expanding the portfolios
nepes Fan-out offers the manufacturing diversification
FOWLP (300mmRd) and PLP (600mmSq) with test & Back-end turnkey service
Drag it from side to side.