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BUSINESS

NEPES, GLOBAL TOP-TIER PARTNER

Fan Out-WLP/PLP

A micro packaging solution to make smaller, high-function
chips by redistributing I/O terminals outside the periphery of the chip.

FOWLP/PLP Solutions

  • Panelization
  • RDL&Bumping
  • Wafer & Panel Test
  • Back Grinding & Sawing
  • Final Test
  • Final Product

FOWLP Vs. FOPLP

To provide multiple package solutions, high reliability and functionality in a smaller footprint for expanding the portfolios

nepes Fan-out offers the manufacturing diversification
FOWLP (300mmRd) and PLP (600mmSq) with test & Back-end turnkey service

Product View

VALUE FOWLP PLP
Product View
Panel Size 300mm 600mm
Features
  • High Reliability
    Meets JEDEC MSL3 CLR and BLR requirements

  • Low Profile Small Form

  • Integration & Size with SiP

  • Innovative process

  • Cost-effectiveness

[M-Series™]

[FOWLP : Face-up]

Drag it from side to side.