Leading the new era with
cutting-edge semiconductor packaging solution
FOPLP
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3D PoP Stackable( mPoP )
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PoP( Package on Package )
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Multi-die( 2die )
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Chip-first( Face-up )
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Chip-first( Face-down )
- A leading technology for next generation in the field of packaging
- Providing the high performance required for the 4th industrial revolution, including 5G and cloud data services
- Utilizing large square panel process in order to innovative productivity improvement and cost reduction beyond fan-out WLP process
- Advanced fan-out packaging technologies (MCP, mPoP, PoP) applicable to various markets and products, such as PMIC, RF module, APE, and memory
3D-SiP
- Multi-die stack solution based on the fan-out method for high bandwidth and high-function devices in the age of 5G and AI
- Provision of low-price/high-function products using fan-out wiring technology and via formation technology, not the platform of TSV and Interposer
- With the creation of 2.5D and 3.D solutions, it is applicable to high-end computing packaging product combining high bandwidth memory and NNP
FOWLP/WLP
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[nWLPRB]
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[nWLPHR]
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[nWLPHC]
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[FOWLP]
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[FOWLP]
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[FOWLP]
- Creation of high-reliability, high-current WLP solution based on the differentiated technology of nepes
- Applicable to products in the fields of automotive, aerospace, and military along with the cutting-edge IT industry