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Investor Relations

NEPES, GLOBAL TOP-TIER PARTNER

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News


Due to the explosive growth of the generative artificial intelligence market such as Chat GPT, demand for advanced packaging of power semiconductors(PMIC) used in artificial intelligence systems is exploding.


The product that Nepes has won this time and is starting to mass-produce is a power semiconductor for AI chipsets and a high-tech PMIC product that will expand into high-performance computing (HPC) and automobile markets in the future.


Nepes has established a bridgehead for global HPC and automobile markets, starting with mass production of power semiconductors by Global Fabless (US). This new customer is a member of the value chain of AI products and is working with Nepes in a strategic partnership to prepare for explosive growth.


Nepes is developing a number of its customers' products in its advanced packaging line, and it is confirmed that PMIC first shipped last year is installed in AI chipsets of GPUs, CPUs, consumers and IoT companies. Also, The product is expected to be adopted for ADAS for automobiles.


In addition, the two companies are currently collaborating on a 12-inch project and plan to develop products using the 600mm PLP process in the future, diversifying their products and processes and securing competitive advantage in the market.


As semiconductor manufacturing bases have recently accelerated their departure from China and Taiwan, strategic partnerships with global chipmakers and Nepes are expected to become more robust. Nepes will take this opportunity to increase its market share and continue to secure 2.5D / 3D capabilities, the next generation package for artificial intelligence.


A Nepes official said, "Nepes currently has core customers mainly in the smartphone market, and this strategic partnership with new customers has enabled us to target the growing HPC and automotive markets. From an industrial point of view, It will contribute to the structural growth of non-memory manufacturing ecosystems such as foundry and tests, strengthening advanced packaging infrastructure in Korea through attracting fabless."