NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2024-03-28 | 대표이사변경 | 네패스 | 2024-03-28 | 정기주주총회결과 | 네패스 | 2024-03-27 | 사업보고서 (2023.12) | 네패스 | 2024-03-26 | 감사보고서제출 | 네패스 | 2024-03-19 | 기타경영사항(자율공시) (감사보고서 제출 지연) | 네패스 | 2024-03-13 | 주주총회소집공고 | 네패스 | 2024-03-13 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 네패스 | 2024-03-13 | 주주총회소집결의 | 네패스 | 2024-02-26 | 주식등의대량보유상황보고서(일반) | 이병구 | 2023-12-14 | 주주명부폐쇄기간또는기준일설정 | 네패스 |
|---|
Nepes, represented by CEO Byung-Koo Lee, will showcase
its advanced packaging technology at the 25th Semiconductor Exhibition (SEDEX).
SEDEX, celebrating its 25th anniversary this year, is
the only specialized semiconductor exhibition in South Korea that encompasses
all aspects of the semiconductor industry, including materials, components, and
equipment.
Nepes, along with industry leaders like SK Hynix and KEY
FOUNDRY, will represent the semiconductor sector in Chungcheongbuk-do at the
Chungbuk Joint Pavilion. At SEDEX 2023, Nepes plans to exhibit its core
capabilities in advanced packaging technology, featuring 'nePACTM (Nepes
Package in Advanced CX Solution)' and physical displays of 600mm FOPLP (Fan-Out
Panel Level Packaging), as well as 300mm/200mm WLP (Wafer Level Packaging).
They aim to introduce their advanced packaging technology, capable of reducing
the thickness and enhancing the performance of semiconductors.
SEDEX 2023 will feature the participation of around
250 domestic and international companies, including industry giants like
Samsung Electronics and SK Hynix, occupying 800 booths. The event is scheduled
to take place from the 25th to the 27th of this month at COEX in Samseong-dong,
Seoul.
[SEDEX 2023 Home page] ; https://sedex.org/public_html_eng/index.asp
