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Investor Relations

NEPES, GLOBAL TOP-TIER PARTNER

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Date Disclosure Title Reporter
2024-03-28 대표이사변경 네패스
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2024-03-27 사업보고서 (2023.12) 네패스
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2024-03-13 주주총회소집공고 네패스
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News



The nePAC development team of Nepes participated in the [2023 TECH INSIDE SHOW], which took place from the 18th to the 20th at KINTEX.


 

An exhibit detailing the concept of nePAC (Photo = nePAC Product Technology Division)

 

At the event, Nepes showcased their cutting-edge packaging platform, nePAC (nepes Package in Advanced CX solution), based on RDL interposer and Fan-Out technology. As their primary exhibition theme, the platform, which specializes in 2.5D & 3D packaging, garnered both intrigue and enthusiastic responses from industry professionals.


 

A visitor at the Nepes booth listening to an explanation about nePAC. (Photo = nePAC Product Technology Division)

 

Kim Hyo-Young, the team Leader in charge of the nePAC development team, who oversaw the participation in the exhibition, stated, "Visitors primarily asked many questions regarding the performance of nePAC technology and materials." He added, "This exhibition is the first for nePAC, and it provided a meaningful opportunity to broadly promote the technical expertise of Nepes."


[The [2023 TECH INSIDE SHOW] is an event where South Korean companies, government entities, and organizations in the materials, components, equipment, and foundational industries participate. It serves to showcase the excellence of these industries in South Korea, promoting company products and technologies, and linking them to potential business opportunities.