Cheongju City announced on the 28th that it signed an investment agreement worth 160 billion won with Chungcheongbuk-do and Nepes, a system semiconductor advanced packaging specialist. The agreement was signed on the 27th.
Nepes is a mid-sized company with global competitiveness in the system semiconductor advanced packaging sector. Through this agreement, it plans to invest in expanding production facilities at Ochang Plant 2 in Ochang-eup to respond to the increasing demand for high-performance AI semiconductors.
With the expansion, Nepes is expected to establish itself as a global supplier of semiconductor packaging for AI data centers and chiplet (2.5D, 3D)* packaging.
*Chiplet: A technology that designs and manufactures a single chip by dividing it into multiple small modular chips. Mainly used to integrate AI semiconductors and HBM (high bandwidth memory) into a single package.
Cheongju City will actively support companies to carry out their business stably, and Nepes will actively participate in the development of the local economy by giving priority to local residents for new hires, participating in local construction companies, and purchasing local materials.
A city official said, “Through this investment by Nepes, Cheongju’s status as a center for the advanced semiconductor industry will be further solidified,” and “We will not spare any support to ensure that the business is carried out smoothly.”
Lee Byeong-gu, CEO of Nepes, said, “We will actively respond to the increasing demand for semiconductors for AI, such as data centers, autonomous driving, and humanoid robots, build a K-semiconductor cluster ecosystem, and achieve greater growth in the global semiconductor market.” He added, “We will also contribute to the revitalization of the local economy by coexisting with the local community.”