Nepes participates in the International Symposium on Microelectronics and Packaging (ISMP), an international conference dedicated to the latest trends in semiconductor packaging technology.
The 22nd ISMP, organized by the Korea Society of Microelectronics and Packaging, is held on November 6-8 at the Paradise Hotel in Busan, and is co-hosted with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics(IRSP).
On November 6-7, Nepes will introduce its core technologies, including chiplet and 2.3D technologies, at Lobby Booth 2. On November 6 at 3:50 p.m., Nepes Semiconductor Research Center's Advanced Technology Part Leader Lee Jung Won will present on the topic of “Chip-let Heterogeneous Integration Packaging Based on Fan-out RDL Interposer Technology”.