Nepes, a semiconductor post-processing (OSAT) specialist, is targeting the popular edge computing market with advanced packaging technology based on the fan-out (FO) process. It plans to target the 2.5D packaging and chiplet markets based on technologies such as RDL (re-wiring) interposers and silicon bridges. Kang In-soo, head of Nepes Semiconductor Research Institute (executive director), explained at the ‘Advanced Electronic Assembly Technology and Market Trend Seminar’ held at the Suwon Convention Center on the 2nd, “We are talking about on-device (edge) AI now, but in reality, it seems that the algorithms suitable for it have not yet transitioned to edge computing.” He added, “The inference AI market is expected to grow 10 times larger than the learning market in the future, which means that the AI market that we can enjoy has not yet arrived.” He added, “I think the true AI era will come when we transition to popular edge computing, and we need to prepare for that era.”
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