nepes will participate in the Electronic Components and Technology Conference(ECTC) held online from June 1 to July 4, 2021 and introduce advanced packaging technology based on 'End-fab' technology.
ECTC, which marks its 71st anniversary this year, is a worldwide prestigious event in the fields of packaging, electronic components and technology education, and is a place for cooperation and technology exchange in which 106 global semiconductor companies participate.
▲nepes Virtual Conference in ECTC
▲In-Soo Kang, Head of Future Technology Planning Division, introducing nSiP solutions in the 2021 ECTC Technical Program
nepes participated in this event as a conference sponsor and participated in 'nSiP (nepes' System in Package) Platform for Various Module Packaging Applications' (Kang In-soo, Kim Jong-heon, Lee Jun-gyu, Shin Won-sun, Kim Nam-cheol, Park Sang-yong) and 600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' (Jacinta Aman Lim, Park Yoon-mook, Edil De Vera, Kim Byeong-cheol, Brett Dunlap ) will release a presentation video.
Event information: https://www.ectc.net
■Presentation video
'nSiP(System in Package) Platform for Various Module Packaging Applications' : https://youtu.be/-i0k_kHHGJU
'600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' : https://youtu.be/zskiFK--8gQ
■Brochure
nSiP : https://url.kr/1yfwne
nPLP : https://url.kr/6plyox