Nepes participated in the 2023 ECTC (Electronic Components and Technology Conference) held in Orlando, Florida, USA from May 30th to June 2nd and introduced its advanced semiconductor packaging technology.
Celebrating its 73rd anniversary this year, ECTC is an international event hosted by the Electronics Packaging Society under the IEEE, and is a place where experts in the field of electronic parts, materials, packaging, and IoT attend to discuss next-generation semiconductor technologies.
At this event, Nepes introduced next-generation PoP (Package on Package), 2.5D, and 3D stacking technologies as well as the world's first 600mm FOPLP solution that was successfully mass-produced. FOPLP is a next-generation packaging solution that implements a fan-out package on a large square panel with a size of 600mm × 600mm, a step forward from the existing 300mm circular fan-out wafer level packaging (FOWLP).
On the 31st, a paper titled “6-Sided Die Protection for Chiplet Package with Multi-Layer RDL” was selected and presented.