Advanced semiconductor packaging foundry specialist Nepes announced on the 9th at the 'World-Class Product Certification award Ceremony’ held at the Grand InterContinental Seoul Parnas, that their advanced packaging technology, Wafer Level Package (WLP), has been selected as a 'Current World-Class Product.'
▲Nepes' WLP certified as '2023 Current
World-Class Product' by the Ministry of Trade, Industry and Energy (Photo =
Nepes)
World-Class Products are distinguished
annually by the Ministry of Trade, Industry and Energy and operated by the
Korea Trade-Investment Promotion Agency (KOTRA), divided into 'Current World
Class Products' and 'Next Generation World Class Products' to lead the global
market, enhance corporate competitiveness, and contribute to export vitality.
Nepes' Wafer Level Package was uniquely
selected in the semiconductor sector as a 'Next Generation World Class Product'
in 2016. Since then, it has renewed its certification, meeting conditions such
as ranking within the top five in global market share and 5% or higher, along
with an annual export scale of at least five million dollars, thereby newly
elevating to the status of a 'Current World Class Product.'
Wafer Level Packaging is an advanced
packaging technology that performs bumping and Redistribution Layer (RDL) on
fully processed wafers, differing from conventional packaging. Nepes
successfully mass-produced advanced packaging applying bumping technology for
the first time in Korea in 2000. Semiconductors utilizing this technology have
significantly improved electrical characteristics due to shorter external
connection wiring and also boast excellent heat dissipation properties,
preventing overheating and effectively reducing production costs. Moreover, by
forming solder bumps on the chip's I/O pads, replacing wires, it enables
miniaturization and high integration, and is currently widely applied in
mobile, PC, cameras, and more.
Nepes has grown to become a core value
chain in the domestic system semiconductor ecosystem based on commercializing
advanced technologies such as Fan-out WLP and Fan-out Panel Level Package
(FO-PLP), in a domestic market scarce of system semiconductor players.
Currently, with global-level technology and manufacturing competitiveness,
Nepes is attracting prominent overseas customers to Korea, expanding and
sophisticating advanced foundry infrastructure.
At the event, Lee Sang-min, manager of
Nepes' management planning team, who received the certification, expressed,
"It is very meaningful that Nepes' advanced packaging technology has been
recognized for its excellence and marketability in the semiconductor industry
and elevated to a 'Current World Class Product.' We will continue to strive to
drive the ecosystem of system semiconductors in Korea and sustain our
growth."
Additionally, Nepes presented a successful case
study in the medium-sized enterprise category at the ceremony.