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Nepes joins the American Semiconductor Innovation Coalition (ASIC) to Strengthen Global Semiconductor Cooperation

Nepes, led by Chairman Lee Byung-Koo,  has announced its participation in the American Semiconductor Innovation Coalition (ASIC) to help strengthen global semiconductor cooperation. As members of ASIC, Nepes will contribute to developing a strong proposal for a technical agenda in advanced packaging. ASIC is a coalition of more than 75 businesses, startups, universities, national labs, and nonprofits dedicated to bringing the best research and development to the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP). It aims to strengthen the diverse and competitive semiconductor workforce, make bold investments in semiconductor R&D, and academic infrastructure needed to deliver semiconductor innovation, prototyping and manufacturing in the United States.

Dr. Douglas Grose, who is leading ASIC, said, “ASIC is focused on working collaboratively to develop new strategies and solutions for the U.S. semiconductor industry, and that includes partnerships with international organizations. We’re very pleased to have Nepes join ASIC and provide their expertise on advanced packaging, which is increasingly critical to the semiconductor industry both in the U.S. and worldwide.”

ASIC member companies include key companies in the semiconductor field in Korea, the US, Europe, and Japan. As OSAT companies, i3 Microsystems of the US and Nepes of Korea are participating.

“As the importance and role of advanced packaging technology continues to grow, ASIC enables Nepes to further strengthen cooperation with leading global member companies,” said Kim Tae-hoon, president at Nepes. “It has given us an opportunity to raise the status of Korean companies’ advanced packaging technology and contribute to the development of the advanced back-end industry and the global semiconductor ecosystem.”