Nepes, represented by CEO Byung-Koo Lee, will showcase
its advanced packaging technology at the 25th Semiconductor Exhibition (SEDEX).
SEDEX, celebrating its 25th anniversary this year, is
the only specialized semiconductor exhibition in South Korea that encompasses
all aspects of the semiconductor industry, including materials, components, and
equipment.
Nepes, along with industry leaders like SK Hynix and KEY
FOUNDRY, will represent the semiconductor sector in Chungcheongbuk-do at the
Chungbuk Joint Pavilion. At SEDEX 2023, Nepes plans to exhibit its core
capabilities in advanced packaging technology, featuring 'nePACTM (Nepes
Package in Advanced CX Solution)' and physical displays of 600mm FOPLP (Fan-Out
Panel Level Packaging), as well as 300mm/200mm WLP (Wafer Level Packaging).
They aim to introduce their advanced packaging technology, capable of reducing
the thickness and enhancing the performance of semiconductors.
SEDEX 2023 will feature the participation of around
250 domestic and international companies, including industry giants like
Samsung Electronics and SK Hynix, occupying 800 booths. The event is scheduled
to take place from the 25th to the 27th of this month at COEX in Samseong-dong,
Seoul.
[SEDEX 2023 Home page] ; https://sedex.org/public_html_eng/index.asp