Nepes, represented by CEO Byung-Koo Lee, is set to participate in the International
Symposium on Microelectronics and Packaging (ISMP) organized by the Korean
Society for Microelectronics and Packaging (KMEPS) and deliver a lecture
session.
ISMP, now in its 21st edition, serves as a platform to
explore the semiconductor packaging industry, share the latest technologies,
and discuss strategies among various companies.
Nepes, as the only domestic advanced packaging
specialist, is returning to ISMP for the second time following its
participation last year. In the "Package Design and Modeling2"
session, Dr. Kang In-soo, the head of the semiconductor research institute,
will present on the topic of "5G mmWave Antenna in Package based on
Fan-out RDL Interposer Technology." The presentation will introduce Nepes'
FO-AiP, highlighting its capabilities in reducing thickness and enhancing
performance in antenna modules.
The keynote speeches for the event will be delivered
by Samsung Electronics and JCET. Additionally, attendees from 12 countries,
including Korea, will explore the emerging trends in next-generation packaging
technologies for industries such as artificial intelligence (AI), IoT, big
data, and machine learning.
ISMP 2023 will take place at the Paradise Hotel
Busan from the 25th to the 27th of this month.
[ISMP 2023 Home Page] ; https://www.ismp.or.kr/html/