The nePAC development team of Nepes participated in
the [2023 TECH INSIDE SHOW], which took place from the 18th to the 20th at
KINTEX.
▲An exhibit detailing the concept of nePAC
(Photo = nePAC Product Technology Division)
At the event, Nepes showcased their cutting-edge
packaging platform, nePAC (nepes Package in Advanced CX solution), based on RDL
interposer and Fan-Out technology. As their primary exhibition theme, the
platform, which specializes in 2.5D & 3D packaging, garnered both intrigue
and enthusiastic responses from industry professionals.
▲ A visitor at the Nepes booth listening to an explanation about nePAC. (Photo
= nePAC Product Technology Division)
Kim Hyo-Young, the team Leader in charge of the nePAC
development team, who oversaw the participation in the exhibition, stated,
"Visitors primarily asked many questions regarding the performance of
nePAC technology and materials." He added, "This exhibition is the
first for nePAC, and it provided a meaningful opportunity to broadly promote
the technical expertise of Nepes."
[The [2023 TECH INSIDE SHOW] is an event where South Korean companies, government entities, and organizations in the materials, components, equipment, and foundational industries participate. It serves to showcase the excellence of these industries in South Korea, promoting company products and technologies, and linking them to potential business opportunities.