NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2026-11-04 | 기업설명회(IR)개최 | 네패스 | 2026-10-14 | 기업설명회(IR)개최 | 네패스 | 2026-09-30 | 주식등의대량보유상황보고서(일반) | 이창우 | 2026-09-17 | 기업설명회(IR)개최 | 네패스 | 2026-08-14 | 반기보고서 (2026.06) | 네패스 | 2026-07-07 | 기업설명회(IR)개최 | 네패스 | 2026-06-30 | 주식등의대량보유상황보고서(일반) | 이창우 | 2026-06-15 | 임원ㆍ주요주주특정증권등소유상황보고서 | 백종식 | 2026-06-08 | 임원ㆍ주요주주특정증권등소유상황보고서 | 백종식 | 2026-05-15 | 분기보고서 (2026.03) | 네패스 |
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By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.
(the rest omitted)
[Source = The Korea Times http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]
