Siemens Digital Industries Software today announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.

“nepes is committed to providing us with the most comprehensive portfolio of semiconductor packaging design and manufacturing services, to help us innovate and succeed in a market where high performance and compact form factors are critical.” said Brad Seo, vice president of SAPEON Korea’s R&D center. “By expanding nepes’ adoption and usage of Siemens’ EDA technologies for advanced packaging, we also can achieve the innovative technologies necessary to grow.”

nepes has an established track record of providing customers with world-class packaging, testing, and semiconductor assembly services for clients throughout the global electronics industry. nepes also offers packaging design services including wafer level packaging, fan-out wafer level packages, and panel level packaging.

Building on this foundation, nepes is now driving additional packaging innovation with a broad range of advanced technologies from Siemens EDA, including the Calibre® nmPlatform tool, HyperLynx™ software for electrical rule checking, Calibre® 3DSTACK software, as well as Siemens’ industry-leading Xpedition™ Substrate Integrator software and Xpedition™ Package Designer software. Together, these Siemens technologies helped nepes provide fast and reliable design services including 2.5D/3D-based chiplet designs for the company’s growing base of global IC customers.

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Read more : https://www.eejournal.com/industry_news/nepes-corporation-expands-ic-packaging-capabilities-for-the-3dic-era-with-advanced-design-flows-from-siemens/