Nepes participated in the 2024 Electronic Components and Technology Conference (ECTC) in Denver, Colorado, USA from May 28 to 31 (local time) to showcase advanced semiconductor packaging technology.

Celebrating its 74th anniversary this year, the 2024 ECTC is an international event hosted by the IEEE-affiliated Electronics Packaging Society and boasts the world's largest electronic component technology society.

Nepes presented a 600mm FOPLP solution and a chipset packaging based on a fan-out RDL interposer at the event.

On the next day of the event, the technical program participated in the announcement of advanced packaging technology with Samsung Electronics and SK Hynix as Korean companies.Nepes introduced the excellence of FOPLP as a replacement for the traditional package QFN, titled '600mm x 600mm Fan-Out Panel Level Package (FOPLP) as an Alternative to Lead-Frame-Free Quad Flat No Lead (QFN) Package'.

In the Interactive Presentations session held on the same day, I also presented my thesis on 'Single and Multi NPU Chiplet Heterogeneous Integration Packaging Based on Fan-Out RDL Interposer with Silicon Bridge Technology'.