▲Kim Jong-heon, Vice President, Lecture at the 2024 Industrialization Session of Nano Korea

Nepes gave a lecture on advanced semiconductor packaging technology at 'Nano Korea 2024 Industrialization Session' held at KINTEX 1st exhibition hall in Goyang City on the 4th.

Kim Jong-heon, vice president of Nepes CTO, said, "The advanced packaging technology in AI era; Chiplet and Integration ', introduced chiplet and heterogeneous packaging technology, a cutting-edge semiconductor packaging trend.

Nano Korea is one of the world's top three nanotechnology events, hosted by the Ministry of Trade, Industry and Energy and the Ministry of Science and ICT, and organized by the Nano Convergence Research Association and the Nanotechnology Research Council. Among them, the industrialization session is a program that domestic and foreign global companies announce in-depth about the direction of their nanotechnology commercialization, and invited nine speakers of next-generation semiconductor and display industries, including Nepes, Samsung Electronics and SK Hynix, to give lectures.

Vice President Kim Jong-heon said, "The development of Gen AI is accelerating changes in many fields such as life and industry," and explained, "In the packaging field as well as the entire semiconductor process, AI semiconductor-oriented bumping, 2.5D, and chiplet technologies continue to develop, and Nepes also has and develops related technologies and is pushing for commercialization."He added, "In addition to packaging technology, heat dissipation performance, which is closely related to power consumption, is also becoming important." He emphasized the importance of developing innovative materials along with package structure design.

Meanwhile, Nano Korea is a high-tech exhibition that can confirm the commercialization status of nanotechnology and roadmap of famous domestic and foreign companies. 400 companies from 40 countries participated and 12,000 people visited.