NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2025-04-01 | 신규시설투자등 | 네패스 | 2025-03-28 | 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 네패스 | 2025-03-28 | 정기주주총회결과 | 네패스 | 2025-03-20 | 사업보고서 (2024.12) | 네패스 | 2025-03-20 | 감사보고서제출 | 네패스 | 2025-03-13 | 주주총회집중일개최사유신고 | 네패스 | 2025-03-13 | 주주총회소집공고 | 네패스 | 2025-03-13 | 주주총회소집결의 | 네패스 | 2025-03-13 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 네패스 | 2025-02-25 | [기재정정]타법인주식및출자증권취득결정 | 네패스 |
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Nepes participates in the International Symposium on Microelectronics and Packaging (ISMP), an international conference dedicated to the latest trends in semiconductor packaging technology.
The 22nd ISMP, organized by the Korea Society of Microelectronics and Packaging, is held on November 6-8 at the Paradise Hotel in Busan, and is co-hosted with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics(IRSP).
On November 6-7, Nepes will introduce its core technologies, including chiplet and 2.3D technologies, at Lobby Booth 2. On November 6 at 3:50 p.m., Nepes Semiconductor Research Center's Advanced Technology Part Leader Lee Jung Won will present on the topic of “Chip-let Heterogeneous Integration Packaging Based on Fan-out RDL Interposer Technology”.
