NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2026-11-04 | 기업설명회(IR)개최 | 네패스 | 2026-10-14 | 기업설명회(IR)개최 | 네패스 | 2026-09-30 | 주식등의대량보유상황보고서(일반) | 이창우 | 2026-09-17 | 기업설명회(IR)개최 | 네패스 | 2026-08-14 | 반기보고서 (2026.06) | 네패스 | 2026-07-07 | 기업설명회(IR)개최 | 네패스 | 2026-06-30 | 주식등의대량보유상황보고서(일반) | 이창우 | 2026-06-15 | 임원ㆍ주요주주특정증권등소유상황보고서 | 백종식 | 2026-06-08 | 임원ㆍ주요주주특정증권등소유상황보고서 | 백종식 | 2026-05-15 | 분기보고서 (2026.03) | 네패스 |
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Nepes participates in the International Symposium on Microelectronics and Packaging (ISMP), an international conference dedicated to the latest trends in semiconductor packaging technology.
The 22nd ISMP, organized by the Korea Society of Microelectronics and Packaging, is held on November 6-8 at the Paradise Hotel in Busan, and is co-hosted with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics(IRSP).
On November 6-7, Nepes will introduce its core technologies, including chiplet and 2.3D technologies, at Lobby Booth 2. On November 6 at 3:50 p.m., Nepes Semiconductor Research Center's Advanced Technology Part Leader Lee Jung Won will present on the topic of “Chip-let Heterogeneous Integration Packaging Based on Fan-out RDL Interposer Technology”.
