Nepes participated in the Semiconductor Packaging Policy Forum held on September 25 at the SC Convention Center in Seoul, where CTO Jongheon Kim delivered a keynote presentation titled “Growth Strategy for Mid-Sized OSAT Companies and Industry-Academia-Government Collaboration.”

In his presentation, Mr. Kim addressed the limitations of 2.5D packaging (CoWoS), a core technology in the AI semiconductor market, and stated, “In the future, packaging technologies that replace expensive silicon interposers and shift to square panel formats will gain attention.” He added, “The industry is already discussing 3.5D packaging technologies that incorporate vertical stacking, and companies that secure next-generation technologies and build robust supply chains will lead the market.”

Mr. Kim also outlined strategic directions for enhancing the competitiveness of mid-sized OSAT companies, including:

• Customer-driven technology development,
• Proactive supply chain establishment, and
• Timely response to advanced packaging technologies.
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Furthermore, he emphasized the need for government policy support and increased investment to help mid-sized OSAT companies strengthen their technological capabilities. In particular, he highlighted the importance of public sector involvement in the commercialization of advanced packaging technologies and the establishment of evaluation infrastructure for materials and equipment.

The forum, hosted by the Korean Microelectronics and Packaging Society (KMEPS), brought together experts from industry, academia, and research institutions to discuss the future of advanced packaging and policy directions. Through this presentation, Nepes reaffirmed its leadership in the industry by offering practical insights into growth strategies and ecosystem collaboration for mid-sized OSAT companies.

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