Nepes successfully delivered a presentation titled “Fan-Out Embedded Bridge Interposer for Scalable Heterogeneous Integration of NPUs and HBMs” at ISMP 2025 (23rd International Symposium on Microelectronics and Packaging), held from November 4 to 7 at the Inter-Burgo Hotel in Daegu.

The presentation showcased Nepes’ achievements in developing fan-out-based bridge interposer technology for heterogeneous integration of AI processors and high-bandwidth memory (HBM). Attendees praised the session for offering practical solutions to achieve high-density, high-speed, and low-power packaging.

ISMP 2025 is an international symposium spotlighting advanced packaging technologies such as 3D/2.5D integration, chiplet-based design, hybrid bonding, and UCIe interfaces. This year, numerous sessions focused on AI semiconductors and next-generation memory integration. Leading global semiconductor companies—including Intel, Samsung Electronics, SK hynix, Lam Research, Tokyo Electron, PulseForge, and Samsung Electro-Mechanics—participated as presenters, alongside academic experts from UCLA, USC, and KAIST, fostering active technical exchange and collaboration.

Through this presentation, Nepes emphasized the design flexibility advantages of its proprietary Fan-Out Embedded Bridge Interposer technology and highlighted its potential applications in high-performance domains such as AI servers, edge computing, and autonomous vehicles.

Jungwon Lee, Director of Nepes Semiconductor Research Center and presenter of the session, stated:
“Our ISMP 2025 presentation was an opportunity to demonstrate Nepes’ efforts not only in RDL interposer development but also in securing Fan-Out Embedded Bridge Interposer technology. We will continue to lead innovation in AI semiconductor packaging as a representative of Korean companies.”

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