NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2025-11-14 | 분기보고서 (2025.09) | 네패스 | 2025-09-30 | 주식등의대량보유상황보고서(일반) | 이창우 | 2025-08-14 | 반기보고서 (2025.06) | 네패스 | 2025-07-04 | [기재정정]신규시설투자등 | 네패스 | 2025-06-16 | 주식등의대량보유상황보고서(일반) | 이창우 | 2025-06-16 | 임원ㆍ주요주주특정증권등소유상황보고서 | 이창우 | 2025-06-16 | 주식등의대량보유상황보고서(일반) | 이병구 | 2025-06-16 | 임원ㆍ주요주주특정증권등소유상황보고서 | 이병구 | 2025-06-16 | 최대주주변경 | 네패스 | 2025-05-16 | 주식등의대량보유상황보고서(일반) | 이병구 |
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By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.
(the rest omitted)
[Source = The Korea Times http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]
