NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2024-03-28 | 대표이사변경 | 네패스 | 2024-03-28 | 정기주주총회결과 | 네패스 | 2024-03-27 | 사업보고서 (2023.12) | 네패스 | 2024-03-26 | 감사보고서제출 | 네패스 | 2024-03-19 | 기타경영사항(자율공시) (감사보고서 제출 지연) | 네패스 | 2024-03-13 | 주주총회소집공고 | 네패스 | 2024-03-13 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 네패스 | 2024-03-13 | 주주총회소집결의 | 네패스 | 2024-02-26 | 주식등의대량보유상황보고서(일반) | 이병구 | 2023-12-14 | 주주명부폐쇄기간또는기준일설정 | 네패스 |
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Nepes participated in the 2023 ECTC (Electronic Components and Technology Conference) held in Orlando, Florida, USA from May 30th to June 2nd and introduced its advanced semiconductor packaging technology.
Celebrating its 73rd anniversary this year, ECTC is an international event hosted by the Electronics Packaging Society under the IEEE, and is a place where experts in the field of electronic parts, materials, packaging, and IoT attend to discuss next-generation semiconductor technologies.
At this event, Nepes introduced next-generation PoP (Package on Package), 2.5D, and 3D stacking technologies as well as the world's first 600mm FOPLP solution that was successfully mass-produced. FOPLP is a next-generation packaging solution that implements a fan-out package on a large square panel with a size of 600mm × 600mm, a step forward from the existing 300mm circular fan-out wafer level packaging (FOWLP).
On the 31st, a paper titled “6-Sided Die Protection for Chiplet Package with Multi-Layer RDL” was selected and presented.
