Nepes, represented by CEO Byung-Koo Lee,  is set to participate in the International Symposium on Microelectronics and Packaging (ISMP) organized by the Korean Society for Microelectronics and Packaging (KMEPS) and deliver a lecture session.

ISMP, now in its 21st edition, serves as a platform to explore the semiconductor packaging industry, share the latest technologies, and discuss strategies among various companies.

Nepes, as the only domestic advanced packaging specialist, is returning to ISMP for the second time following its participation last year. In the "Package Design and Modeling2" session, Dr. Kang In-soo, the head of the semiconductor research institute, will present on the topic of "5G mmWave Antenna in Package based on Fan-out RDL Interposer Technology." The presentation will introduce Nepes' FO-AiP, highlighting its capabilities in reducing thickness and enhancing performance in antenna modules.

The keynote speeches for the event will be delivered by Samsung Electronics and JCET. Additionally, attendees from 12 countries, including Korea, will explore the emerging trends in next-generation packaging technologies for industries such as artificial intelligence (AI), IoT, big data, and machine learning.

ISMP 2023 will take place at the Paradise Hotel Busan from the 25th to the 27th of this month.

[ISMP 2023 Home Page] ; https://www.ismp.or.kr/html/