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NEPES, GLOBAL TOP-TIER PARTNER

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News

Nepes has developed next-generation packaging PoP (Package on Package) technology for artificial intelligence (AI) and advanced semiconductor, and is working with domestic and foreign chip manufacturers to commercialize it.


Recently, as the AI package market has been struggling with the global supply chain due to the oligopoly of Taiwanese companies, Nepes has developed and commercialized PoP technology, which is the base technology of 2.5D packaging *, utilizing its strengths, RDL technology.


* 2.5D packaging: A technique for horizontally matching a semiconductor die on a wide substrate-shaped interposer, which is mainly used to integrate AI semiconductors and HBM (High Bandwidth Memory) into a single package.


2.5D packaging, which is being developed by Nepes, has the advantage of price competitiveness and small form factor by implementing a rewiring (RDL) interposer using a fan-out process instead of an expensive silicon (Si) interposer.

In particular, the developed PoP technology includes element technologies such as semiconductor device embedding technology, double-sided rewiring (RDL) technology, and Vertical Interconnection. It is a basic platform technology of advanced packaging that can expand its use to smartphone and automobile AP (Application Processor), wearable sensors, and AI semiconductors.


Kim Jong-heon, chief executive officer of Nepes CTO, has been awarded "excellent performance by a global semiconductor company in Japan, a manufacturer of LiDAR sensors, which is a core technology for autonomous car, and is in the process of negotiating product applications. We are actively discussing commercialization. And based on the PoP technology developed this time, we will concentrate on 2.5D packaging technology for AI semiconductors and complete development with customers in the first half of 25 years and aim to mass-produce from the second half."


Nepes is a strategic market that drives next-generation growth and aims to enter the commercialization of 2.5D and PoP technologies from the second half of 2025 by actively collaborating with AI server, automobile and edge computing product customers.


press release inquiry : pr@nepes.co.kr