NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2024-07-05 | 채무인수결정 | 네패스 | 2024-06-24 | [기재정정]신규시설투자등 | 네패스 | 2024-05-16 | 분기보고서 (2024.03) | 네패스 | 2024-03-28 | 대표이사변경 | 네패스 | 2024-03-28 | 정기주주총회결과 | 네패스 | 2024-03-27 | 사업보고서 (2023.12) | 네패스 | 2024-03-26 | 감사보고서제출 | 네패스 | 2024-03-19 | 기타경영사항(자율공시) (감사보고서 제출 지연) | 네패스 | 2024-03-13 | 주주총회소집공고 | 네패스 | 2024-03-13 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 네패스 |
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By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.
(the rest omitted)
[Source = The Korea Times http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]
